# US 12,183,498 B2 · Power conversion device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,183,498 B2 - Document ID: US12183498B2 - Status: Granted - Kind: B2 - Application number: 17/608,678 - Filed: 2020-05-20 - Published: 2022-07-07 - Granted: 2024-12-31 - Earliest claimed: 2019-05-27 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Hiroyuki Kiyonaga; Kenta Fujii; Yuji Shirakata; Tomohito Fukuda - Web page: https://patentgrep.com/patent/US12183498B2 ## CPC - H01F 27/2804: {Printed windings} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H01F 27/22: Cooling by heat conduction through solid or powdered fillings - H02M 1/327: {against abnormal temperatures} - H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 3/285: {Single converters with a plurality of output stages connected in parallel (parallel operation of a plurality of converters in DC distribution networks H02J1/10)} - H02M 3/33573: {Full-bridge at primary side of an isolation transformer} - H01F 27/263: {Fastening parts of the core together} - H01F 27/2814: {with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets} - H02M 1/0064: {Magnetic structures combining different functions, e.g. storage, filtering or transformation} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board. ## Claims ### Claim 1 A power conversion device comprising: an electronic component including a first component and a second component; a first substrate including a first principal surface on which the first component of the electronic component is mounted and a second principal surface opposite to the first principal surface; a first cooling body thermally connected to the second principal surface of the first substrate; a second substrate including a third principal surface on which the second component of the electronic component is mounted and a fourth principal surface opposite to the third principal surface; and a second cooling body thermally connected to the fourth principal surface of the second substrate, wherein the first cooling body forms a bottom surface of a support body, the second cooling body forms a side surface of the support body, the second cooling body extends in a direction from the second principal surface of the first substrate toward the first principal surface, and the second substrate is disposed on a surface of the second cooling body facing the first substrate. ### Claim 2 (depends on 1) The power conversion device according to claim 1, further comprising an external cooling body thermally connected to the first cooling body, wherein each of the first cooling body and the second cooling body is formed in a plate shape, and a thickness of the first cooling body in a direction in which the second principal surface is opposite to the first principal surface is thinner than a thickness of the second cooling body in a direction in which the fourth principal surface is opposite to the third principal surface. ### Claim 3 A power conversion device comprising: an electronic component including a first component, a second component, and a third component; a first substrate including a first principal surface on which the first component of the electronic component is mounted and a second principal surface opposite to the first principal surface; a first cooling body thermally connected to the second principal surface of the first substrate; a second substrate including a third principal surface on which the second component of the electronic component is mounted and a fourth principal surface opposite to the third principal surface; a second cooling body thermally connected to the fourth principal surface of the second substrate; a third substrate including a fifth principal surface on which the third component of the electronic component is mounted and a sixth principal surface opposite to the fifth principal surface; and a third cooling body thermally connected to the sixth principal surface of the third substrate, wherein the second cooling body extends in a direction from the second principal surface of the first substrate toward the first principal surface, the third cooling body extends in the direction from the second principal surface of the first substrate toward the first principal surface, and the second substrate and the third substrate are disposed to face each other. ### Claim 4 (depends on 3) The power conversion device according to claim 3, further comprising an external cooling body thermally connected to the first cooling body, wherein each of the first cooling body, the second cooling body, and the third cooling body is formed in a plate shape, and a thickness of the first cooling body in a direction in which the second principal surface is opposite to the first principal surface is thinner than a thickness of the second cooling body in a direction in which the fourth principal surface is opposite to the third principal surface and a thickness of the third cooling body in a direction in which the sixth principal surface is opposite to the fifth principal surface. ### Claim 5 (depends on 3) The power conversion device according to claim 3, further comprising: a first insulating member disposed between the second principal surface of the first substrate and the first cooling body; a second insulating member disposed between the fourth principal surface of the second substrate and the second cooling body; and a third insulating member disposed between the sixth principal surface of the third substrate and the third cooling body, wherein the first cooling body is thermally connected to the second principal surface of the first substrate through the first insulating member, the second cooling body is thermally connected to the fourth principal surface of the second substrate through the second insulating member, and the third cooling body is thermally connected to the sixth principal surface of the third substrate through the third insulating member. ### Claim 6 (depends on 3) The power conversion device according to claim 3, wherein the second cooling body is thermally connected to the first cooling body, and the third cooling body is thermally connected to the first cooling body. ### Claim 7 (depends on 6) The power conversion device according to claim 6, further comprising a first heat conductive member, wherein the first cooling body is thermally connected to each of the second cooling body and the third cooling body through the first heat conductive member. ### Claim 8 (depends on 3) The power conversion device according to claim 3, further comprising: a fourth cooling body thermally connected to the first cooling body, the second cooling body, and the third cooling body; and a fifth cooling body thermally connected to the first cooling body, the second cooling body, and the third cooling body, wherein the fourth cooling body extends in the direction from the second principal surface of the first substrate toward the first principal surface, and the fifth cooling body extends in the direction from the second principal surface of the first substrate toward the first principal surface. ### Claim 9 (depends on 8) The power conversion device according to claim 8, wherein each of the fourth cooling body and the fifth cooling body is formed in a plate shape, and a thickness of each of the fourth cooling body and the fifth cooling body in a direction orthogonal to the direction from the second principal surface of the first substrate toward the first principal surface is thicker than a thickness of the first cooling body in a direction in which the second principal surface is opposite to the first principal surface. ### Claim 10 (depends on 9) The power conversion device according to claim 9, further comprising a second heat conductive member, wherein the fourth cooling body is thermally connected to each of the first cooling body, the second cooling body, and the third cooling body through the second heat conductive member, and the fifth cooling body is thermally connected to each of the first cooling body, the second cooling body, and the third cooling body through the second heat conductive member. ### Claim 11 (depends on 8) The power conversion device according to claim 8, wherein the electronic component includes a fourth component, the power conversion device further comprises: a fourth substrate including a seventh principal surface on which the fourth component of the electronic component is mounted and an eighth principal surface opposite to the seventh principal surface; and a fourth insulating member disposed between the eighth principal surface of the fourth substrate and the fourth cooling body, and the fourth cooling body is thermally connected to the eighth principal surface of the fourth substrate through the fourth insulating member. ### Claim 12 (depends on 8) The power conversion device according to claim 8, wherein the electronic component includes a fifth component, the power conversion device further comprises: a fifth substrate including a ninth principal surface on which the fifth component of the electronic component is mounted and a tenth principal surface opposite to the ninth principal surface; and a fifth insulating member disposed between the tenth principal surface of the fifth substrate and the fifth cooling body, and the fifth cooling body is thermally connected to the tenth principal surface of the fifth substrate through the fifth insulating member. ### Claim 13 (depends on 8) The power conversion device according to claim 8, further comprising a sealing member filling a space surrounded by the first cooling body, the second cooling body, the third cooling body, the fourth cooling body, and the fifth cooling body. ### Claim 14 (depends on 13) The power conversion device according to claim 13, wherein the sealing member has volume resistivity greater than or equal to 1×1010 Ω·m. ### Claim 15 (depends on 3) The power conversion device according to claim 3, wherein the electronic component includes a sixth component, the power conversion device further comprises a sixth substrate on which the sixth component of the electronic component is mounted, and a calorific value of the sixth component is smaller than a calorific value of each of the first component, the second component, and the third component. ### Claim 16 (depends on 3) The power conversion device according to claim 3, further comprising a current path member, wherein a part or all of the first cooling body, the second cooling body, and the third cooling body form a first energization path, and the current path member forms a second energization path electrically connected in parallel to the first energization path. ### Claim 17 (depends on 16) The power conversion device according to claim 16, wherein an electric resistance value of the second energization path is lower than an electric resistance value of the first energization path.