# US 12,183,497 B2 · High-insulation multilayer planar transformer and circuit board integration thereof

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- Number: US 12,183,497 B2
- Document ID: US12183497B2
- Status: Granted
- Kind: B2
- Application number: 17/132,278
- Filed: 2020-12-23
- Published: 2022-06-23
- Granted: 2024-12-31
- Earliest claimed: 2020-12-23
- Assignees: P-Duke Technology Co., Ltd.
- Applicants: P-Duke Technology Co., Ltd.
- Inventors: Lien-Hsing Chen; Hsiao-Hua Chi; Chun-Ping Chang; Han-Chiang Chen; Chia-Ti Lai; Yung-Chi Chang
- Web page: https://patentgrep.com/patent/US12183497B2

## CPC

- H01F 27/2804: {Printed windings}
- H01F 27/24: Magnetic cores
- H01F 27/2819: {Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit}
- H01F 27/323: {Insulation between winding turns, between winding layers}
- H01F 27/324: {Insulation between coil and core, between different winding sections, around the coil; Other insulation structures}
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.

## Claims

### Claim 1

A circuit board integration of high-insulation multilayer planar transformer, the circuit board integration comprising:
a first insulating layer, consisting of two first insulating plates stacked with each other;
a second insulating layer, consisting of two second insulating plates stacked with each other;
a first coil winding in a U-shape with two distal ends both located at a first side, disposed between the first insulating layer and the second insulating layer, and surrounding a through hole planarly;
a third insulating layer, consisting of two third insulating plates stacked with each other; and
a second coil winding in a U-shape with two distal ends both located at a second side opposite to the first side, disposed between the second insulating layer and the third insulating layer, and surrounding the through hole planarly;
wherein a thickness of the first insulating layer, a thickness of the second insulating layer and a thickness of the third insulating layer are equal to or greater than 0.05 mm and equal to or less than 1 mm respectively, a distance of a periphery of the first coil winding to a periphery of the first insulating layer is equal to or greater than 0.1 mm and equal to or less than 1 mm, and a distance of a periphery of the second coil winding to a periphery of the second insulating layer is equal to or greater than 0.1 mm and equal to or less than 1 mm.

### Claim 2 (depends on 1)

The circuit board integration according to claim 1, wherein the first coil winding is disposed on the second insulating layer; and the second coil winding is disposed on the third insulating layer.

### Claim 3 (depends on 1)

The circuit board integration according to claim 1, wherein the first insulating plate, the second insulating plate and the third insulating plate comprise a glass fiber.

### Claim 4

A high-insulation multilayer planar transformer, comprising:
a pair of iron cores, comprising a first iron core and a second iron core arranged oppositely, the first iron core comprising a first base and a first core pillar connected to the first base, and the second iron core comprising a second base and a second core pillar connected to the second base; and
a circuit board integration, stacked between the first iron core and the second iron core, comprising:
a first insulating layer, consisting of two first insulating plates stacked with each other;
a second insulating layer, consisting of two second insulating plates stacked with each other;
a first coil winding in a U-shape with two distal ends both located at a first side, disposed between the first insulating layer and the second insulating layer, and surrounding a through hole planarly;
a third insulating layer, consisting of two third insulating plates stacked with each other; and
a second coil winding in a U-shape with two distal ends both located at a second side opposite to the first side, disposed between the second insulating layer and the third insulating layer, and surrounding the through hole planarly;
wherein the through hole is inserted with the first core pillar and the second core pillar;
wherein a thickness of the first insulating layer, a thickness of the second insulating layer and a thickness of the third insulating layer are equal to or greater than 0.05 mm and equal to or less than 1 mm respectively, a distance of a periphery of the first coil winding to a periphery of the first insulating layer is equal to or greater than 0.1 mm and equal to or less than 1 mm; and a distance of a periphery of the second coil winding to a periphery of the second insulating layer is equal to or greater than 0.1 mm and equal to or less than 1 mm.

### Claim 5 (depends on 4)

The high-insulation multilayer planar transformer according to claim 4, wherein one insulating plate located on an outside portion of the first insulating layer contacting the iron core is free from a circuit in an area covered by the iron core.

### Claim 6 (depends on 4)

The high-insulation multilayer planar transformer according to claim 4, wherein the first coil winding is disposed on the second insulating layer; and the second coil winding is disposed on the third insulating layer.