# US 12,183,484 B2 · Controlled cable attenuation

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- Number: US 12,183,484 B2
- Document ID: US12183484B2
- Status: Granted
- Kind: B2
- Application number: 17/727,754
- Filed: 2022-04-24
- Published: 2023-10-26
- Granted: 2024-12-31
- Earliest claimed: 2022-04-24
- Assignees: Dell Products L.P.
- Applicants: Dell Products L.P.
- Inventors: Sandor Farkas; Bhyrav Mutnury
- Web page: https://patentgrep.com/patent/US12183484B2

## CPC

- H01B 7/30: with arrangements for reducing conductor losses when carrying alternating current, e.g. due to skin effect
- H01B 11/18: Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

A cable comprising a conductor in a center of the cable, a dielectric layer surrounding the conductor and a resistive coating may be provided. The resistive coating may be applied to an exposed portion of the conductor and disposed with the dielectric layer. The resistance of the resistive coating when combined with an impedance of the cable prior to application of the resistive coating reaches a target impedance.

## Claims

### Claim 1

A cable, comprising:
a conductor in a center of the cable;
a dielectric layer surrounding the conductor; and
a resistive coating applied to an exposed portion of the conductor and disposed with the dielectric layer, wherein a resistance of the resistive coating when combined with an impedance of the cable prior to application of the resistive coating reaches a target impedance wherein the resistive coating is applied to the exposed portion of the conductor after the exposed portion of the conductor is soldered to a contact of a printed circuit board.

### Claim 2 (depends on 1)

The cable of claim 1, wherein the resistive coating is applied to a particular length.

### Claim 3 (depends on 1)

The cable of claim 1, wherein the resistive coating is applied to a particular thickness.

### Claim 4 (depends on 1)

The cable of claim 1, wherein a portion of the resistive coating is removed to adjust the resistance of the resistive coating.

### Claim 5 (depends on 1)

The cable of claim 1, wherein the cable further includes a second resistive coating applied to a second exposed portion of the conductor.

### Claim 6 (depends on 1)

The cable of claim 1, wherein the resistive coating is applied before an ultraviolet glue is applied.

### Claim 7 (depends on 1)

The cable of claim 1, wherein the impedance of the cable includes a first impedance of the conductor and a second impedance of the dielectric layer.

### Claim 8

An information handling system, comprising:
a printed circuit board; and
a cable to be soldered to the printed circuit board, the cable including:
a conductor;
a dielectric layer surrounding the conductor;
a first resistive layer surrounding a first exposed portion of the conductor and disposed with the dielectric layer, wherein the first resistive layer is applied to the first exposed portion of the conductor and a resistance of the first resistive layer when combined with an impedance of the cable prior to application of the first resistive layer reaches a target impedance; and
a second resistive layer applied to a second exposed portion of the conductor.

### Claim 9 (depends on 8)

The information handling system of claim 8, wherein the first resistive layer is applied to a particular length.

### Claim 10 (depends on 8)

The information handling system of claim 8, wherein the first resistive layer is applied to a particular thickness.

### Claim 11 (depends on 8)

The information handling system of claim 8, wherein a portion of the first resistive layer is removed to adjust the resistance of the first resistive layer.

### Claim 12 (depends on 8)

The information handling system of claim 8, wherein the second resistive layer is applied before an ultraviolet glue is applied.

### Claim 13 (depends on 8)

The information handling system of claim 8, wherein the second resistive layer is applied to the second exposed portion of the conductor after the first exposed portion of the conductor is soldered to a contact of the printed circuit board.

### Claim 14 (depends on 8)

The information handling system of claim 8, wherein the impedance of the cable includes a first impedance of the conductor and a second impedance of the dielectric layer.

### Claim 15

A method, comprising:
determining an impedance of a cable;
determining a target impedance for the cable; and
based on the impedance of the cable and the target impedance, applying a first resistive coating to a first exposed portion of a center conductor of a first end of the cable, wherein the first resistive coating is applied to the first exposed portion of the center conductor after the first exposed portion of the center conductor is soldered to a contact of a printed circuit board.

### Claim 16 (depends on 15)

The method of claim 15, wherein the applying of the first resistive coating is performed to a particular length.

### Claim 17 (depends on 15)

The method of claim 15, wherein the applying of the first resistive coating is performed to a particular thickness.

### Claim 18 (depends on 15)

The method of claim 15, further comprising adjusting resistance of the first resistive coating by removing portions of the first resistive coating.

### Claim 19 (depends on 15)

The method of claim 15, wherein the first resistive coating is applied to the first exposed portion of the center conductor before an ultraviolet glue is applied.

### Claim 20 (depends on 15)

The method of claim 15, further comprising applying a second resistive coating of a second length to a second exposed portion of the center conductor at a second end of the cable.