# US 12,181,940 B2 · Temperature control component for electronic systems wherein a thermal transfer component is tappered > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,181,940 B2 - Document ID: US12181940B2 - Status: Granted - Kind: B2 - Application number: 17/724,622 - Filed: 2022-04-20 - Published: 2022-08-04 - Granted: 2024-12-31 - Earliest claimed: 2019-12-11 - Assignees: Micron Technology, Inc. - Applicants: Micron Technology, Inc. - Inventors: Daniel G. Scobee; Aleksandr Semenuk; Aswin Thiruvengadam - Web page: https://patentgrep.com/patent/US12181940B2 ## CPC - G06F 1/206: {comprising thermal management} - H10W 40/28: comprising Peltier coolers - G01R 31/2874: {related to temperature} - H10N 10/13: characterised by the heat-exchanging means at the junction - H10N 19/101: {Multiple thermocouples connected in a cascade arrangement} - H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) - G01R 31/2862: {Chambers or ovens; Tanks} - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 40/43: by flowing gases, e.g. forced air cooling - H10W 40/641: {Snap-on arrangements, e.g. clips} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 40/77: Auxiliary members characterised by their shape - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract An apparatus includes a first thermoelectric component (TEC), a second TEC, a thermal transfer component disposed between the first TEC and the second TEC and a thermal conduction layer. The thermal conduction layer is coupled to the second TEC. The thermal conduction layer includes a planar area configured to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component. ## Claims ### Claim 1 An apparatus comprising: a first thermoelectric component (TEC); a second TEC; a thermal transfer component disposed between the first TEC and the second TEC, wherein the thermal transfer component is tapered between a first surface that is thermally coupled to the first TEC and a second surface that is thermally coupled to the second TEC; and a thermal conduction layer coupled to the second TEC, wherein the thermal conduction layer comprises a planar area configured to be positioned above two or more electronic devices of a plurality of electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein a bottom surface of the thermal conduction layer further comprises a notched area, wherein the planar area is intersected by the notched area, and wherein the notched area comprises a void in the thermal conduction layer that extends in a vertical direction from the planar area towards the second TEC. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the thermal conduction layer further comprises a top surface, a front side, a back side, a first end, and a second end, and wherein the notched area extends from the front side to the back side of the thermal conduction layer. ### Claim 4 (depends on 2) The apparatus of claim 2, wherein the planar area at the bottom surface of the thermal conduction layer is intersected by the notched area to form a first planar sub-area and a second planar sub-area, wherein the first planar sub-area and the second planar sub-area are orientated parallel to a plane and orientated a same vertical distance from the plane. ### Claim 5 (depends on 2) The apparatus of claim 2, wherein the notched area of the thermal conduction layer is to be positioned above at least one electronic device of the plurality of electronic devices to insulate the at least one electronic device from the transfer of the thermal energy. ### Claim 6 (depends on 1) The apparatus of claim 1, further comprising: a thermal pad comprising a top surface and a bottom surface, wherein the top surface of the thermal pad to couple to at least the planar area of the bottom surface of the thermal conduction layer. ### Claim 7 (depends on 6) The apparatus of claim 6, wherein the thermal pad comprises a material that is thermally conductive, an electrical insulator, and compressible. ### Claim 8 (depends on 1) The apparatus of claim 1, further comprising: a heat sink comprising a top surface and a bottom surface, wherein the bottom surface of the heat sink is coupled to the first TEC to transfer the thermal energy from the first TEC to the heat sink. ### Claim 9 (depends on 8) The apparatus of claim 8, further comprising: a plurality of attachment members of the heat sink, the plurality of attachment members to receive a plurality of adjustable coupling members to adjustably couple the apparatus to a thermal chamber. ### Claim 10 (depends on 8) The apparatus of claim 8, further comprising: an electric fan disposed above the top surface of the heat sink to transfer the thermal energy from the heat sink to an adjacent medium. ### Claim 11 A system to test a plurality of electronic devices under a variety of thermal conditions, the system comprising: an electronic system comprising the plurality of electronic devices; and a temperature control component comprising: a first thermoelectric component (TEC); a second TEC; a thermal transfer component disposed between the first TEC and the second TEC, wherein the thermal transfer component is tapered between a first surface that is thermally coupled to the first TEC and a second surface that is thermally coupled to the second TEC; and a thermal conduction layer coupled to the second TEC, wherein the thermal conduction layer comprises a planar area configured to be positioned above two or more electronic devices of the plurality of electronic devices of the electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component. ### Claim 12 (depends on 11) The system of claim 11, further comprising: a thermal chamber comprising a plurality of sides, wherein a side of the plurality of sides comprises a port that exposes a chamber within the thermal chamber, wherein the port is configured to receive a bottom part of the temperature control component within the chamber, and wherein a top part of the temperature control component extends externally to the thermal chamber. ### Claim 13 (depends on 11) The system of claim 11, wherein a bottom surface of the thermal conduction layer further comprises a notched area, wherein the planar area is intersected by the notched area, and wherein the notched area comprises a void in the thermal conduction layer that extends in a vertical direction from the planar area towards the second TEC. ### Claim 14 (depends on 13) The system of claim 13, wherein the thermal conduction layer further comprises a top surface, a front side, a back side, a first end, and a second end, and wherein the notched area extends from the front side to the back side of the thermal conduction layer. ### Claim 15 (depends on 13) The system of claim 13, wherein the planar area at the bottom surface of the thermal conduction layer is intersected by the notched area to form a first planar sub-area and a second planar sub-area, wherein the first planar sub-area and the second planar sub-area are orientated parallel to a plane and orientated a same vertical distance from the plane. ### Claim 16 (depends on 13) The system of claim 13, wherein the notched area of the thermal conduction layer is to be positioned above at least one electronic device of the plurality of electronic devices to insulate the at least one electronic device from the transfer of the thermal energy. ### Claim 17 (depends on 13) The system of claim 13, further comprising: a thermal pad comprising a top surface and a bottom surface, wherein the top surface of the thermal pad to couple to at least the planar area of the bottom surface of the thermal conduction layer. ### Claim 18 (depends on 17) The system of claim 17, wherein the thermal pad comprises a material that is thermally conductive, an electrical insulator, and compressible. ### Claim 19 (depends on 18) The system of claim 18, further comprising: a heat sink comprising a top surface and a bottom surface, wherein the bottom surface of the heat sink is coupled to the first TEC to transfer the thermal energy from the first TEC to the heat sink. ### Claim 20 (depends on 19) The system of claim 19, further comprising: a plurality of attachment members of the heat sink, the plurality of attachment members to receive a plurality of adjustable coupling members to adjustably couple the thermal transfer component to a thermal chamber.