# US 12,181,939 B2 · Electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,181,939 B2 - Document ID: US12181939B2 - Status: Granted - Kind: B2 - Application number: 17/971,704 - Filed: 2022-10-24 - Published: 2023-03-30 - Granted: 2024-12-31 - Earliest claimed: 2021-09-30 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Dongoh Jang; Kwangbok Park; Gyunghoon Lee - Web page: https://patentgrep.com/patent/US12181939B2 ## CPC - G06F 1/203: {for portable computers, e.g. for laptops} - G06F 1/16: Constructional details or arrangements - G06F 1/1635: {Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter} - G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module} - G06F 1/1698: {the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266)} - G06F 1/20: Cooling means - H05K 7/14: Mounting supporting structure in casing or on frame or rack - H05K 7/1427: {Housings} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device according to various embodiments of the disclosure includes a housing including a first surface, a second surface formed parallel to the first surface, and a side surface enclosing a space formed between the first surface and the second surface. The electronic device includes a printed circuit board disposed on the first surface of the housing and an antenna module spaced apart from the side surface of the housing by a predetermined distance and disposed at the first surface of the housing. The electronic device includes also includes a first cable configured to electrically connect the printed circuit board and the antenna module and a heat dissipation unit disposed on one surface of the printed circuit board and having, at one surface thereof, a cable seating path in which at least a portion of the first cable is seated. ## Claims ### Claim 1 An electronic device, comprising: a housing including a first surface, a second surface formed substantially parallel to the first surface, and a side surface enclosing a space formed between the first surface and the second surface; a printed circuit board disposed on the first surface of the housing; an antenna module spaced apart from the side surface of the housing by a predetermined distance and disposed on the first surface of the housing; a first cable configured to electrically connect the printed circuit board and the antenna module; and a heat dissipation unit disposed at one surface of the printed circuit board and having, at one surface thereof, a cable seating path in which at least a portion of the first cable is seated. ### Claim 2 (depends on 1) The electronic device of claim 1, further comprising a second cable electrically connectable to the printed circuit board, wherein the first cable and the second cable are spaced apart by at least a predetermined minimum distance. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the cable seating path is one of a plurality of cable seating paths at the one surface of the heat dissipation unit. ### Claim 4 (depends on 3) The electronic device of claim 3, wherein the plurality of cable seating paths are spaced apart from each other by a predetermined distance. ### Claim 5 (depends on 1) The electronic device of claim 1, wherein the cable seating path is one of a plurality of cable seating paths, and a plurality of first cables, including the first cable, are disposed in the cable seating path. ### Claim 6 (depends on 1) The electronic device of claim 1, wherein the cable seating path comprises a protrusion member capable of fixing the first cable. ### Claim 7 (depends on 1) The electronic device of claim 1, wherein the cable seating path comprises a straight area in which the first cable is disposed in a straight line and a bending area in which the first cable is bent and disposed. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the heat dissipation unit comprises a board exposure area exposing one surface of the printed circuit board. ### Claim 9 (depends on 8) The electronic device of claim 8, wherein the board exposure area has a length of a first distance in a first direction and a length of a second distance in a second direction. ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the heat dissipation unit forms an upper end layer having a predetermined height at one surface thereof, and the cable seating path is formed at one side of the upper end layer. ### Claim 11 An electronic device, comprising: a housing including a first surface, a second surface formed substantially parallel to the first surface, and a side surface enclosing a space formed between the first surface and the second surface; a printed circuit board disposed at the first surface of the housing; an antenna module spaced apart from the side surface of the housing and disposed at the first surface of the housing; a first cable configured to electrically connect the printed circuit board and the antenna module; and a heat dissipation unit disposed at one surface of the printed circuit board and having a protruding area protruded by a predetermined length at one side thereof, wherein the protruding area comprises a cable seating area in which at least a portion of the first cable is seated. ### Claim 12 (depends on 11) The electronic device of claim 11, further comprising a second cable electrically connectable to the printed circuit board, wherein the first cable and the second cable are spaced apart by at least a predetermined minimum distance. ### Claim 13 (depends on 11) The electronic device of claim 11, wherein the protruding area is a one of a plurality of protruding areas in the heat dissipation unit. ### Claim 14 (depends on 13) The electronic device of claim 13, wherein the plurality of protrusion areas are formed at intervals of a predetermined distance. ### Claim 15 (depends on 11) The electronic device of claim 11, wherein the first cable is one of a plurality of cables that are disposed in the cable seating area of the protruding area. ### Claim 16 (depends on 15) The electronic device of claim 15, wherein the plurality of first cables are disposed to be spaced apart from each other by a predetermined distance. ### Claim 17 (depends on 11) The electronic device of claim 11, wherein the protruding area has a predetermined height in a direction away from one surface of the heat dissipation unit. ### Claim 18 (depends on 11) The electronic device of claim 11, wherein the first cable comprises a cable straight area in which the first cable is formed in a straight line and a cable bending area in which the first cable is bent and formed. ### Claim 19 (depends on 11) The electronic device of claim 11, wherein the heat dissipation unit comprises a board exposure area exposing one surface of the printed circuit board in at least a portion thereof. ### Claim 20 (depends on 11) The electronic device of claim 11, further comprising: a shield member disposed between at least a portion of the printed circuit board and the heat dissipation unit; and a battery, wherein at least a portion of the battery is disposed on substantially coplanar with the printed circuit board.