# US 12,181,723 B2 · Optical waveguide package and light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,181,723 B2 - Document ID: US12181723B2 - Status: Granted - Kind: B2 - Application number: 17/760,780 - Filed: 2020-05-28 - Published: 2022-11-03 - Granted: 2024-12-31 - Earliest claimed: 2019-09-30 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Yoshiaki Itakura; Yasuhiro Fujimoto; Hiroki Ito - Web page: https://patentgrep.com/patent/US12181723B2 ## CPC - G02B 6/4257: {having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence)} - G02B 6/42: Coupling light guides with opto-electronic elements - G02B 6/4251: {Sealed packages (G02B6/4248 takes precedence)} - G02B 6/4268: {Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47)} - H01S 5/02208: characterised by the shape of the housings - H01S 5/4093: {Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract An optical waveguide package includes a substrate, an optical waveguide layer located on an upper surface of the substrate and including a cladding and a core in the cladding, a lid, and a metal member. The cladding includes a first surface facing the substrate, a second surface opposite to the first surface, and an element-receiving area being open in the second surface. The lid covers the element-receiving area. The metal member surrounds the element-receiving area between the cladding and the lid. ## Claims ### Claim 1 An optical waveguide package, comprising: a substrate; a cladding on the substrate, the cladding including a first surface facing the substrate, a second surface opposite to the first surface, an element-receiving area being open in the second surface, and a protrusion protruding from the second surface; a core in the cladding and extending from the element-receiving area, wherein the protrusion is above the core; a lid covering the element-receiving area; a bond member surrounding the element-receiving area between the cladding and the lid; and an external wiring member electrically connecting an element in the element-receiving area to an external circuit, wherein the external wiring member is not located between the lid and the cladding, the lid faces the second surface and the protrusion, and the bond member is located above the second surface and the protrusion. ### Claim 2 (depends on 1) The optical waveguide package according to claim 1, wherein the second surface includes a first region surrounding the element-receiving area in a plan view and a second region other than the first region, and the lid is located only on the first region. ### Claim 3 (depends on 2) The optical waveguide package according to claim 2, wherein the cladding includes a step in the first region, and the lid is fitted to the step. ### Claim 4 (depends on 2) The optical waveguide package according to claim 2, wherein the protrusion extends from the first region to the second region. ### Claim 5 (depends on 1) The optical waveguide package according to claim 1, wherein the cladding includes a plurality of the element-receiving areas and a partition between the plurality of element-receiving areas. ### Claim 6 (depends on 1) The optical waveguide package according to claim 1, wherein the lid includes a contact portion to be in contact with a light-emitting element. ### Claim 7 (depends on 1) The optical waveguide package according to claim 1, wherein the external wiring member penetrates the cladding. ### Claim 8 (depends on 1) The optical waveguide package according to claim 1 further comprising: a first metal member located on the second surface and located between the bond member and the cladding. ### Claim 9 (depends on 8) The optical waveguide package according to claim 8, wherein the lid further includes a second metal member on a surface facing the second surface, and the bond member is located between the first metal member and the second metal member. ### Claim 10 (depends on 8) The optical waveguide package according to claim 8, wherein the first metal member is located on the protrusion. ### Claim 11 (depends on 10) The optical waveguide package according to claim 10, wherein the bond member between the lid and the first metal member is thinner on the protrusion than on other area. ### Claim 12 (depends on 1) The optical waveguide package according to claim 1, wherein the protrusion extends along the core. ### Claim 13 (depends on 1) The optical waveguide package according to claim 1, wherein the core is at least partially within the protrusion. ### Claim 14 (depends on 1) A light-emitting device, comprising: the optical waveguide package according to claim 1; and a light-emitting element in the element-receiving area, the light-emitting element is die-bonded to the external wiring member. ### Claim 15 (depends on 1) The optical waveguide package according to claim 1 further comprising: a light-receiving element in the element-receiving area. ### Claim 16 A light-emitting device, comprising: a substrate; a cladding on the substrate, the cladding including a first surface facing the substrate, a second surface opposite to the first surface, an element-receiving area being open in the second surface, and a protrusion; a core in the cladding and extending from the element-receiving area, wherein the protrusion is above the core; a lid having a recess and covering the element-receiving area; a light-emitting element in the element-receiving area; a bond member surrounding the element-receiving area between the cladding and the lid and located above the protrusion; and an external wiring member electrically connecting the light-emitting element to an external circuit; and a lens on an optical path of light to be emitted from the core, wherein the external wiring member is not located between the lid and the cladding, and the light-emitting element extends from the element-receiving area into the recess.