# US 12,181,710 B2 · Photonic integrated circuit packaging architecture

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- Number: US 12,181,710 B2
- Document ID: US12181710B2
- Status: Granted
- Kind: B2
- Application number: 17/237,375
- Filed: 2021-04-22
- Published: 2022-10-27
- Granted: 2024-12-31
- Earliest claimed: 2021-04-22
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Omkar G. Karhade; Xiaoqian Li; Tarek A. Ibrahim; Ravindranath Vithal Mahajan; Nitin A. Deshpande
- Web page: https://patentgrep.com/patent/US12181710B2

## CPC

- G02B 6/1225: {comprising photonic band-gap structures or photonic lattices}
- G02B 6/30: for use between fibre and thin-film device
- G02B 6/12002: {Three-dimensional structures}
- G02B 6/32: having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)}
- G02B 6/4204: {the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208)}
- G02B 6/4274: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)}
- G02B 2006/1213: {comprising photonic band-gap structures or photonic lattices}
- G02B 2006/12176: {Etching}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/9413: {on encapsulations}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICs. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active side. A substantial portion of the active side is in contact with the insulating material, and the PIC is electrically coupled to the package support and to the IC. The photonic package further includes an optical lens coupled to the PIC on the lateral side. In some embodiments, the photonic package further includes an interposer between the PIC or the IC and the package support.

## Claims

### Claim 1

A photonic package, comprising:
a package support;
an integrated circuit (IC);
an insulating material;
an interposer having a first side and a second side opposite to the first side, wherein the package support is proximate to the second side of the interposer, and the IC is within the interposer;
a photonic IC (PIC) having an active side and a lateral side substantially perpendicular to the active side, wherein:
the PIC is proximate to the first side of the interposer,
the insulating material is between the PIC and the first side of the interposer,
at least one optical structure is on the active side,
a portion of the active side is in contact with the insulating material, and
the PIC is electrically coupled to the package support and to the IC; and
an optical lens coupled to the PIC on the lateral side.

### Claim 2 (depends on 1)

The photonic package of claim 1, wherein the PIC is electrically coupled to the IC with interconnects.

### Claim 3 (depends on 2)

The photonic package of claim 2, wherein a pitch of the interconnects is between 20 micrometer and 30 micrometer.

### Claim 4 (depends on 2)

The photonic package of claim 2, wherein the interconnects are of a first type, wherein the PIC is electrically coupled to the package support with interconnects of a second type.

### Claim 5 (depends on 4)

The photonic package of claim 4, wherein a pitch of the interconnects of the first type is less than a pitch of the interconnects of the second type.

### Claim 6 (depends on 1)

The photonic package of claim 1, further comprising another IC, wherein the IC comprises a bridge circuit enabling electrical coupling to the another IC.

### Claim 7 (depends on 6)

The photonic package of claim 6, wherein the another IC comprises a processor circuit.

### Claim 8 (depends on 1)

The photonic package of claim 1, wherein the insulating material comprises an underfill between the PIC and the first side of the interposer.

### Claim 9 (depends on 1)

The photonic package of claim 1, further comprising another IC, wherein:
the another IC is proximate to the first side of the interposer, and
the another IC is electrically coupled to the package support and to the IC.

### Claim 10 (depends on 1)

The photonic package of claim 1, wherein the portion of the active side that is in contact with the insulating material is a substantial portion of the active side.

### Claim 11 (depends on 1)

The photonic package of claim 1, wherein a surface of the optical lens closest to the lateral side of the PIC is substantially flat.

### Claim 12 (depends on 1)

The photonic package of claim 1, wherein the optical lens is coupled to the lateral side with optical glue.

### Claim 13 (depends on 1)

The photonic package of claim 1, wherein, in a cross-section of the photonic package in a plane substantially perpendicular to the package support, a portion of the optical lens is in a single plane with a portion of the interposer.

### Claim 14

A photonic integrated circuit (PIC) comprising:
an active side having at least one optical structure, wherein at least about 90 percent of the active side is in contact with an insulating material; and
a lateral side coupled to an optical lens, wherein the lateral side is substantially perpendicular to the active side,
wherein the PIC is electrically coupled to an integrated circuit (IC) by interconnects of a first type and to a package substrate by interconnects of a second type.

### Claim 15 (depends on 14)

The PIC of claim 14, wherein the insulating material comprises an interposer material or an underfill material.

### Claim 16

A method of fabricating a photonic package assembly, comprising:
providing an interposer having a first side, a second side opposite to the first side, and a lateral side substantially perpendicular to the first side and the second side;
disposing a first-level die in the interposer;
disposing a second-level die proximate to the first side of the interposer;
providing electrical coupling between the first-level die and the second-level die with interconnects of a first type;
exposing at least one optical structure on the first-level die or the second-level die proximate to the lateral side of the interposer; and
coupling an optical lens to the at least one optical structure.

### Claim 17 (depends on 16)

The method of claim 16, wherein exposing the at least one optical structure comprises polishing the lateral side.

### Claim 18 (depends on 16)

The method of claim 16, further comprising disposing a sacrificial material over the first side of the interposer proximate to the lateral side, wherein exposing the at least one optical structure comprises removing at least a portion of the sacrificial material.

### Claim 19 (depends on 16)

The method of claim 16, further comprising disposing an underfill between the second-level die and the first side of the interposer.

### Claim 20 (depends on 19)

The method of claim 19, further comprising:
coupling the interposer to a package support proximate to the second side; and
disposing another underfill between the package support and the second side of the interposer.