# US 12,181,492 B1 · Probe head and substrate inspection device including the same

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- Number: US 12,181,492 B1
- Document ID: US12181492B1
- Status: Granted
- Kind: B1
- Application number: 18/594,257
- Filed: 2024-03-04
- Granted: 2024-12-31
- Earliest claimed: 2024-02-19
- Applicants: Kee Bok Seo
- Inventors: Kee Bok Seo
- Web page: https://patentgrep.com/patent/US12181492B1

## CPC

- G01R 1/04: Housings; Supporting members; Arrangements of terminals
- G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A probe head includes a test board configured to test a reliability of a semiconductor substrate by contacting the semiconductor substrate, a load pusher provided on the test board, the load pusher including a frame, a plurality of elastic structures, and a loader blade, the frame having a penetration region, the plurality of elastic structures extending from an inner surface of the frame within the penetration region and spaced apart from each other along a circumferential direction, the loader blade configured to protrude the test board toward the semiconductor substrate, the loader blade connecting to the frame through the plurality of elastic structures, and a support tensioner configured to support the load pusher.

## Claims

### Claim 1

A probe head, comprising:
a test board configured to test a reliability of a semiconductor substrate by contacting the semiconductor substrate;
a load pusher provided on the test board, the load pusher including a frame, a plurality of elastic structures, and a loader blade, the frame having a penetration region, the plurality of elastic structures extending from an inner surface of the frame within the penetration region and spaced apart from each other along a circumferential direction, the loader blade configured to protrude the test board toward the semiconductor substrate, the loader blade connecting to the frame through the plurality of elastic structures; and
a support tensioner configured to support the load pusher,
wherein each of the plurality of elastic structures includes:
a plurality of first extending portions extending in a vertical direction and having a first width in a horizontal direction perpendicular to the vertical direction, the horizontal direction being perpendicular to a direction in which each of the plurality of elastic structures extends; and
a plurality of second extending portions extending between the plurality of first extending portions and having a second width smaller than the first width in the horizontal direction.

### Claim 2 (depends on 1)

The probe head of claim 1, wherein each of the plurality of elastic structures has a meander structure extending in a zigzag pattern with repeated regular units.

### Claim 3 (depends on 1)

The probe head of claim 1, wherein each of the plurality of elastic structures has a first surface and a second surface opposite to the second surface, the first surface and the second surface face to each other in the vertical direction, and each of the plurality of elastic structures has a plurality of first and second patterns respectively extending from the first and second surfaces toward each other.

### Claim 4 (depends on 1)

The probe head of claim 1, wherein each of the plurality of elastic structures has a first surface and a second surface opposite to the second surface, the first surface and the second surface face to each other in the vertical direction, and each of the plurality of elastic structures has a plurality of third patterns respectively extending from the first surface.