# US 12,181,358 B2 · Pre-formed solid as coupling mechanism in media-isolated pressure sensors > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,181,358 B2 - Document ID: US12181358B2 - Status: Granted - Kind: B2 - Application number: 17/806,911 - Filed: 2022-06-14 - Published: 2023-12-14 - Granted: 2024-12-31 - Earliest claimed: 2022-06-14 - Assignees: Honeywell International Inc. - Applicants: Honeywell International Inc. - Inventors: Richard Andrew Wade - Web page: https://patentgrep.com/patent/US12181358B2 ## CPC - G01L 9/0054: {integral with a semiconducting diaphragm} - G01L 19/0645: {using isolation membranes, specially adapted for protection} - G01L 9/0052: {of piezoresistive elements (circuits therefor G01L9/06)} - G01L 13/025: {using diaphragms} - G01L 19/0007: {Fluidic connecting means} - G01L 19/0627: {Protection against aggressive medium in general} - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) ## Abstract A media-isolated pressure and force sensor is provided utilizing a deformable solid as a coupling mechanism for transmitting a received external pressure to the surface of a pressure sensing diaphragm. An example media-isolated pressure and force sensor may include a pressure sensing diaphragm that is coupled to a substrate of the media-isolated pressure sensor and a deformable solid. The deformable solid may be configured to deform so as to substantially cover a sensing surface of the pressure sensing diaphragm to create a barrier between the pressure sensing diaphragm and a measured media. In addition, the deformable solid may fluidly couple the measured media to the pressure sensing diaphragm such that in an instance in which a force is applied to the deformable solid by the measured media the force is transmitted to the pressure sensing diaphragm. ## Claims ### Claim 1 A media-isolated pressure sensor, the media-isolated pressure sensor comprising: a pressure sensing diaphragm that is coupled to a substrate of the media-isolated pressure sensor; a deformable solid, wherein the deformable solid is configured to deform so as to substantially cover a sensing surface of the pressure sensing diaphragm to create a barrier between the pressure sensing diaphragm and a measured media; and a ring seal assembly protruding from the substrate and defining a pressure sensing cavity wherein the ring seal assembly extends from the substrate beyond the furthest extent of the pressure sensing diaphragm and forms an enclosed perimeter around a pressure sensing die, and wherein the deformable solid fluidly couples the measured media to the pressure sensing diaphragm such that in an instance in which a force is applied to the deformable solid by the measured media the force is transmitted to the pressure sensing diaphragm. ### Claim 2 (depends on 1) The media-isolated pressure sensor of claim 1, further comprising, a pressure sensing die electrically connected to the pressure sensing diaphragm. ### Claim 3 (depends on 2) The media-isolated pressure sensor of claim 2, wherein the pressure sensing diaphragm is disposed on the pressure sensing die opposite the substrate. ### Claim 4 (depends on 3) The media-isolated pressure sensor of claim 3, wherein the pressure sensing die indicates a magnitude of the force applied by the measured media based on the deflection of the pressure sensing diaphragm. ### Claim 5 (depends on 4) The media-isolated pressure sensor of claim 4, wherein the pressure sensing diaphragm further comprises piezoresistive sensors arranged in a Wheatstone bridge circuit and the magnitude of the force applied by the measured media is determined based on one or more output signals of the Wheatstone bridge circuit. ### Claim 6 (depends on 3) The media-isolated pressure sensor of claim 3, wherein the ring seal assembly comprises an inner perimeter and an outer perimeter, and wherein the inner perimeter is circular. ### Claim 7 (depends on 6) The media-isolated pressure sensor of claim 6, wherein a maximum cross-sectional diameter of the deformable solid is greater than or equal to a diameter of the inner perimeter of the ring seal assembly. ### Claim 8 (depends on 1) The media-isolated pressure sensor of claim 1, wherein the deformable solid further deforms to substantially fill the pressure sensing cavity. ### Claim 9 (depends on 1) The media-isolated pressure sensor of claim 1, wherein the pressure sensing diaphragm is fluidly isolated from the measured media. ### Claim 10 (depends on 1) The media-isolated pressure sensor of claim 1, wherein the deformable solid is manufactured free of defects which change the fluid coupling properties over time. ### Claim 11 (depends on 1) The media-isolated pressure sensor of claim 1, wherein the measured media is a fluid. ### Claim 12 A media-isolated pressure sensor, comprising: pressure sensing circuitry that is attached to a substrate of the media-isolated pressure sensor and comprising a pressure sensing diaphragm disposed on a pressure sensing die, a ring seal assembly protruding from the substrate and defining a pressure sensing cavity, wherein the ring seal assembly extends from the substrate beyond the furthest extent of the pressure sensing diaphragm and forms an enclosed perimeter around the pressure sensing die, and a coupling mechanism comprising a deformable solid that deforms to cover a sensing surface of the pressure sensing diaphragm, wherein the deformable solid fluidly couples a measured media to the pressure sensing diaphragm such that in an instance when a force is applied to the deformable solid by the measured media the force is transmitted to the pressure sensing diaphragm. ### Claim 13 (depends on 12) The media-isolated pressure sensor of claim 12, further comprising a vent in the substrate, fluidly connecting the pressure sensing cavity with an environment opposite the surface of the pressure sensing cavity. ### Claim 14 (depends on 12) The media-isolated pressure sensor of claim 12, wherein the substrate is a printed circuit board. ### Claim 15 (depends on 12) The media-isolated pressure sensor of claim 12, wherein the pressure sensing die is electrically connected to the printed circuit board using one or more through-hole connections. ### Claim 16 (depends on 15) The media-isolated pressure sensor of claim 15, wherein at least one of the one or more through-hole connections fluidly connects the pressure sensing cavity with an environment opposite the substrate of the pressure sensing cavity. ### Claim 17 (depends on 12) The media-isolated pressure sensor of claim 12, wherein the pressure sensing die indicates a magnitude of the force applied by the measured media based at least in part on the deflection of the pressure sensing diaphragm. ### Claim 18 (depends on 12) The media-isolated pressure sensor of claim 12, wherein the pressure sensing diaphragm further comprises piezoresistive sensors arranged in a Wheatstone bridge circuit and a magnitude of the force applied by the measured media is determined based on one or more output signals of the Wheatstone bridge circuit.