# US 12,181,230 B2 · Liquid cooling structure and liquid cooling system including the liquid cooling structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,181,230 B2 - Document ID: US12181230B2 - Status: Granted - Kind: B2 - Application number: 17/075,435 - Filed: 2020-10-20 - Published: 2021-12-30 - Granted: 2024-12-31 - Earliest claimed: 2020-06-29 - Assignees: SK hynix Inc. - Applicants: SK hynix Inc. - Inventors: Nam Hyeon Choi; Seung Jin Ryu; Jeong Bae Jeon - Web page: https://patentgrep.com/patent/US12181230B2 ## CPC - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - H10W 40/47: by flowing liquids, e.g. forced water cooling - F28F 3/04: the means being integral with the element - F28F 13/003: {by using permeable mass, perforated or porous materials (F28F13/18 takes precedence)} - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/20636: {within sub-racks for removing heat from electronic boards} - F28D 2021/0028: {for cooling heat generating elements, e.g. for cooling electronic components or electric devices} - F28F 2210/02: with particular branching, e.g. fractal conduit arrangements - H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)} - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) ## Abstract A liquid cooling structure may include a lower structure and an upper structure. The lower structure may be configured to cover one surface of an object. The upper structure may be combined with the lower structure to provide a channel through which a cooling fluid may flow. The channel may include a plurality of passages connected between a channel inlet through which the cooling fluid may enter and a channel outlet through which the cooling fluid may exits. ## Claims ### Claim 1 A liquid cooling structure for cooling a memory module, the liquid cooling structure comprising: a lower structure configured to cover one surface of the memory module; and an upper structure combined with the lower structure to form a channel through which a cooling fluid flows, wherein the channel comprises an inlet of the channel where the cooling fluid enters, n passages branched at a region adjacent to the inlet of the channel, a connection passage where the n passages join, m passages re-branched at the connection passage and an outlet of the channel where the cooling fluid exits, wherein the channel is divided into an upstream region where the n passages are arranged, and a downstream region where the m passages are arranged based on the connection passage, and wherein “n” is a natural number greater than or equal to 1 and “m” is a natural number greater than the “n”. ### Claim 2 (depends on 1) The liquid cooling structure of claim 1, wherein the channel further comprises a sub-passage positioned between adjacent passages among the plurality of passages to connect the adjacent passages with each other, the sub-passage has a height lower than a height of the adjacent passages, and a cross-sectional shape of the sub-passage is substantially quadrangular. ### Claim 3 (depends on 2) The liquid cooling structure of claim 2, wherein the sub-passage comprises a porous member or a pin structure formed in the sub-passage to have a height lower than that of adjacent passages. ### Claim 4 (depends on 1) The liquid cooling structure of claim 1, wherein the m passages are re-joined at a region adjacent to the outlet of the channel. ### Claim 5 (depends on 4) The liquid cooling structure of claim 4, wherein each of the connection passage and the plurality of passages are separated from each other by molding the upper structure, or by a porous member or a pin structure formed in the channel. ### Claim 6 (depends on 1) The liquid cooling structure of claim 1, wherein each of the passages have a cross-sectional shape that is substantially quadrangular. ### Claim 7 (depends on 1) The liquid cooling structure of claim 1, wherein each of the passages has one or more of a square shape, a rectangular shape, a polygonal shape and an elliptical shape having both flat surfaces in a short axial direction, and the passages have substantially the same height. ### Claim 8 (depends on 1) The liquid cooling structure of claim 1, wherein the lower structure comprises a metal plate having a flat surface or a metal plate having a topology corresponding to a step on one surface of the memory module. ### Claim 9 (depends on 1) The liquid cooling structure of claim 1, wherein the upper structure comprises a metal plate having an engraved structure to form the channel, or a frame-shaped metal plate having one opened portion corresponding to a shape of the channel, wherein the one opened portion is downwardly oriented to combine the upper structure with the lower structure, thereby forming the channel. ### Claim 10 (depends on 1) The liquid cooling structure of claim 1, wherein the channel is defined by a porous member or a pin structure fixedly installed on the lower structure or the upper structure. ### Claim 11 (depends on 1) The liquid cooling structure of claim 1, wherein the memory module comprises a printed circuit board (PCB) including a first surface and a second surface, and a plurality of semiconductor devices mounted on at least one of the first and second surfaces of the PCB, and the PCB comprises a connection terminal connected to a module socket at a lower portion of the PCB. ### Claim 12 (depends on 1) The liquid cooling structure of claim 1, wherein the connection passage is positioned at a middle portion of the memory module. ### Claim 13 (depends on 1) The liquid cooling structure of claim 1, wherein an overlapped area between the m passages of the downstream region and the memory module is larger than an overlapped area between the n passage of the upstream region and the memory module. ### Claim 14 (depends on 1) The liquid cooling structure of claim 1, wherein an overlapped area between the lower structure and the memory module is larger than an overlapped area between the upper structure and the memory module. ### Claim 15 (depends on 1) The liquid cooling structure of claim 1, wherein a thermal conductivity of the upper structure is different from a thermal conductivity of the lower structure. ### Claim 16 (depends on 1) The liquid cooling structure of claim 1, wherein the inlet of the channel and the outlet of the channel are spaced apart from each other by a distance greater than a length of the memory module. ### Claim 17 (depends on 16) The liquid cooling structure of claim 16, wherein the connection passage is positioned at a middle portion between the inlet of the channel and the outlet of the channel.