# US 12,180,607 B2 · Electrochemical deposition system including optical probes > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,180,607 B2 - Document ID: US12180607B2 - Status: Granted - Kind: B2 - Application number: 17/614,139 - Filed: 2020-05-19 - Published: 2022-07-21 - Granted: 2024-12-31 - Earliest claimed: 2019-05-24 - Assignees: Lam Research Corporation - Applicants: Lam Research Corporation - Inventors: Andrew James Pfau; Shantinath Ghongadi, Jr.; Zhian He; Manish Ranjan - Web page: https://patentgrep.com/patent/US12180607B2 ## CPC - C25D 21/12: Process control or regulation (controlling or regulating in general G05) - C25D 5/627: {Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance} - C25D 17/005: {Contacting devices} - C25D 17/06: Suspending or supporting devices for articles to be coated - G01B 11/0633: {using one or more discrete wavelengths} - G01B 11/0683: {measurement during deposition or removal of the layer} - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ## Abstract An electrochemical deposition system includes: an electrochemical deposition chamber including an electrolyte for electrochemical deposition; a substrate holder configured to hold a substrate and including a first cathode that is electrically connected to the substrate; a first actuator configured to adjust a vertical position of the substrate holder within the electrochemical deposition chamber; an anode submerged in the electrolyte; a second cathode arranged between the first cathode and the anode; a first optical probe configured to measure a first reflectivity of the substrate at a first distance from a center of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition; and a controller configured to, based on the first reflectivity, selectively adjust at least one of power applied to the first cathode, power applied to the second cathode, power applied to the anode, and the vertical position of the substrate holder. ## Claims ### Claim 1 An electrochemical deposition system comprising: an electrochemical deposition chamber including an electrolyte for electrochemical deposition; a substrate holder configured to hold a substrate and including a first cathode that is electrically connected to the substrate; a first actuator configured to adjust a vertical position of the substrate holder within the electrochemical deposition chamber; an anode that is submerged in the electrolyte; a second cathode that is arranged between the first cathode and the anode; a first optical probe configured to measure a first reflectivity of the substrate at a first distance from a center of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition; a second actuator configured to, while the substrate is submerged within the electrolyte, move the first optical probe from the first distance from the center of the substrate to a second distance from the center of the substrate that is different than the first distance; and a controller is configured to, during the electrochemical deposition, based on a first value of the first reflectivity measured when the first optical probe is the first distance from the center of the substrate and a second value of the first reflectivity measured when the first optical probe is the second distance from the center of the substrate, selectively adjust the at least one of (i) the power applied to the first cathode, (ii) the power applied to the second cathode, (iii) the power applied to the anode, and (iv) the vertical position of the substrate holder. ### Claim 2 (depends on 1) The electrochemical deposition system of claim 1 further comprising: a second optical probe configured to measure a second reflectivity of the substrate at a second distance from the center of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition, wherein the controller is configured to, during the electrochemical deposition, further based on the second reflectivity of the substrate, selectively adjust at least one of (i) the power applied to the first cathode, (ii) the power applied to the second cathode, (iii) the power applied to the anode, and the (iv) vertical position of the substrate holder. ### Claim 3 (depends on 2) The electrochemical deposition system of claim 2 wherein the first distance is different than the second distance. ### Claim 4 (depends on 1) The electrochemical deposition system of claim 1 wherein the controller is configured to, during the electrochemical deposition, based on a difference between the first value and the second value, selectively adjust at least one of (i) the power applied to the first cathode, (ii) the power applied to the second cathode, (iii) the power applied to the anode, and the (iv) vertical position of the substrate holder. ### Claim 5 (depends on 4) The electrochemical deposition system of claim 4 wherein the controller is configured to, during the electrochemical deposition: determine a first adjustment based on the difference; and apply power to the first cathode based on the first adjustment and a value selected from a first profile. ### Claim 6 (depends on 4) The electrochemical deposition system of claim 4 wherein the controller is configured to, during the electrochemical deposition: determine a second adjustment based on the difference; and apply power to the second cathode based on the second adjustment and a value selected from a second profile. ### Claim 7 (depends on 4) The electrochemical deposition system of claim 4 wherein the controller is configured to, during the electrochemical deposition: determine a third adjustment based on the difference; and adjust the vertical position of the substrate holder based on the third adjustment and a value selected from a third profile. ### Claim 8 (depends on 1) The electrochemical deposition system of claim 1 wherein the first optical probe includes: a first light source configured to transmit light normal to a surface of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition; and a first light detector configured to receive light normal to the surface of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition. ### Claim 9 (depends on 1) The electrochemical deposition system of claim 1 further comprising a window located between the first optical probe and the substrate, wherein the first optical probe is configured to transmit and receive light through the window while the substrate is submerged within the electrolyte during the electrochemical deposition. ### Claim 10 (depends on 1) The electrochemical deposition system of claim 1 wherein the first optical probe includes: a first light source configured to transmit light normal to a surface of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition; and a first light detector configured to receive light through the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition. ### Claim 11 (depends on 1) The electrochemical deposition system of claim 1 further comprising a bar, wherein the first optical probe is located on the bar. ### Claim 12 (depends on 1) The electrochemical deposition system of claim 1 wherein the first optical probe is configured to transmit and receive only a single wavelength of light. ### Claim 13 (depends on 1) The electrochemical deposition system of claim 1 wherein the first optical probe is configured to transmit and receive light within a wavelength range. ### Claim 14 (depends on 1) The electrochemical deposition system of claim 1 further comprising a third actuator configured to rotate the substrate holder during the electrochemical deposition. ### Claim 15 (depends on 1) The electrochemical deposition system of claim 1 wherein the controller is further configured to, during the electrochemical deposition: based on the first value of the first reflectivity of the substrate, detect an endpoint of the electrochemical deposition; and in response to the detection of the endpoint, selectively adjust at least one of (i) the power applied to the first cathode, (ii) the power applied to the second cathode, (iii) the power applied to the anode, and (iv) the vertical position of the substrate holder. ### Claim 16 (depends on 1) The electrochemical deposition system of claim 1 wherein the controller is further configured to, during the electrochemical deposition: based on the first value of the first reflectivity of the substrate, determine a depth of features formed in the substrate; and based on the depth of the features formed in the substrate, selectively adjust at least one of (i) the power applied to the first cathode, (ii) the power applied to the second cathode, (iii) the power applied to the anode, and (iv) the vertical position of the substrate holder. ### Claim 17 (depends on 1) The electrochemical deposition system of claim 1 wherein the controller is further configured to, during the electrochemical deposition: based on the first value of the first reflectivity of the substrate, detect a fault; and in response to the detection of the fault, display an indicator of the fault on a display. ### Claim 18 (depends on 1) The electrochemical deposition system of claim 1 wherein the controller is configured to: determine an average of a plurality of first values of first reflectivity of the substrate measured during an amount of rotation of the substrate during the electrochemical deposition; and during the electrochemical deposition, based on the average, selectively adjust at least one of (i) the power applied to the first cathode, (ii) the power applied to the second cathode, (iii) the power applied to the anode, and (iv) the vertical position of the substrate holder. ### Claim 19 (depends on 1) The electrochemical deposition system of claim 1, wherein the controller is further configured to, during the electrochemical deposition, additionally selectively adjust at least one of (v) an angle of the substrate, and (vi) a distance between the first cathode and the second cathode.