Methods for etching vias in glass-based articles employing positive charge organic molecules
AssigneeCorning Incorporated
InventorsHongmei Hu, Tian Huang, Yuhui Jin
Life of this patent
Estimating the term…
Abstract
Methods of forming vias in a glass-based article by laser-damage-and-etch processes including etching solutions having positive charge organic molecules are disclosed. In some embodiments, a method of forming a via in a glass-based article includes forming a damage track through a bulk of the glass-based article extending from a first surface of the glass-based article to a second surface of the glass-based article, and applying an etching solution to the glass-based article to form the via. The etching solution includes at least one acid and a positive charge organic molecule. An etch rate at the first surface and the second surface is lower than an etch rate at the damage track.
Claims20
A method of forming a via in a glass-based article, the method comprising:
- applying an etching solution to at least a first surface of the glass-based article, the etching solution comprising a positive charge organic molecule and at least one acid, wherein:
- prior to the application of the etching solution, the glass-based article has a damage track formed through a bulk of the glass-based article in a damaged region of the glass-based article the damage track extending from the first surface of the glass-based article to a second surface of the glass-based article, and
- a pH value of the etching solution is greater than an isoelectric point of the glass-based article;
- forming an etching inhibitor layer with the positive charge organic molecule on an undamaged region of the glass-based article such that the etching inhibitor layer retards etching of the glass-based article from the at least one acid such that an etch rate of the undamaged region E2 is lower than an etch rate of the damaged region E1, a ratio of E1/E2 being greater than 1 and less than 20;
- and
- etching the damage track in the damaged region with the at least one acid to form the via.
A method of forming a via in a glass-based article, the method comprising:
- applying a pulsed laser beam having a line focus through a bulk of the glass-based article to form a damage track in a damaged region of the glass-based article, the damage track extending through the bulk of the glass-based article from a first surface of the glass-based article to a second surface of the glass-based article;
- applying an etching solution to at least first surface of the glass-based article, the etching solution comprising PDADMAC and hydrofluoric acid, and
- a pH value of the etching solution being greater than an isoelectric point of the glass-based article;
- and
- forming an etching inhibitor layer with the PDADMAC on an undamaged region of the glass-based article such that the etching inhibitor layer retards etching of the glass-based article from the hydrofluoric acid such that an etch rate of the undamaged region E2 is lower than an etch rate of the damaged region E1, a ratio of E1/E2 being greater than 1 and less than 20.
Dependencies are inferred from the claim text.