# US 12,180,066 B2 · Sensor package and method of producing the sensor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,180,066 B2 - Document ID: US12180066B2 - Status: Granted - Kind: B2 - Application number: 17/228,248 - Filed: 2021-04-12 - Published: 2021-07-29 - Granted: 2024-12-31 - Earliest claimed: 2016-06-21 - Assignees: Sciosense B.V. - Applicants: Sciosense B.V. - Inventors: Willem Frederik Adrianus Besling; Casper Van Der Avoort; Coenraad Cornelis Tak; Remco Henricus Wilhelmus Pijnenburg; Olaf Wunnicke; Hendrik Bouman - Web page: https://patentgrep.com/patent/US12180066B2 ## CPC - B81B 7/0048: {between the MEMS die and the substrate} - B81C 1/0023: {Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261)} - G01D 11/245: {Housings for sensors} - B81B 2201/0264: Pressure sensors - B81B 2207/015: the micromechanical device and the control or processing electronics being integrated on the same substrate - B81B 2207/07: Interconnects - B81C 2203/032: Gluing - B81C 2203/0785: Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates - H10W 72/07352: {changes in structures or sizes} - H10W 72/321: {Structures or relative sizes of die-attach connectors} - H10W 72/884: {Die-attach connectors and bond wires} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer. ## Claims ### Claim 1 A method for producing a sensor package, the method comprising: providing a carrier including electric conductors; fastening a dummy die or an interposer to the carrier; providing an application specific integrated circuit (ASIC) device comprising an integrated sensor element; and fastening the ASIC device to the dummy die or the interposer, wherein the dummy die or the interposer is unstructured and electrically inactive, wherein the ASIC device is fastened to the dummy die or the interposer by an adhesive layer, wherein the ASIC device laterally overhangs the dummy die or the interposer, wherein the sensor element is arranged on a portion of the ASIC device that laterally overhangs the dummy die or the interposer, wherein the adhesive layer directly adjoins the ASIC device, and wherein the adhesive layer directly adjoins the dummy die or the interposer. ### Claim 2 (depends on 1) The method according to claim 1, wherein the adhesive layer comprises silicone. ### Claim 3 (depends on 1) The method according to claim 1, wherein the adhesive layer is formed at least 80 μm thick. ### Claim 4 (depends on 1) The method according to claim 1, wherein the dummy die or the interposer is fastened to the carrier by a bond layer comprising a die attach foil. ### Claim 5 (depends on 1) The method according to claim 1, wherein a coefficient of thermal expansion of the dummy die or the interposer is adapted to a coefficient of thermal expansion of the ASIC device. ### Claim 6 (depends on 1) The method according to claim 1, further comprising providing a cover with an opening, wherein the dummy die or the interposer and the ASIC device are arranged between the carrier and the cover. ### Claim 7 (depends on 1) The method according to claim 1, wherein the dummy die or the interposer includes an electrically inactive semiconductor substrate. ### Claim 8 (depends on 1) The method according to claim 1, wherein the dummy die or the interposer comprises an insulator or glass. ### Claim 9 (depends on 1) The method according to claim 1, wherein the dummy die or the interposer has smaller lateral dimensions than the ASIC device so that a lateral overhang is formed on at least one lateral side of the ASIC device. ### Claim 10 (depends on 1) The method according to claim 1, wherein the dummy die or the interposer has smaller lateral dimensions than the ASIC device so that a lateral overhang is formed on at least two lateral sides of the ASIC device. ### Claim 11 A method for producing a sensor package, the method comprising: providing a carrier including electric conductors; fastening a dummy die to the carrier; providing an application specific integrated circuit (ASIC) device comprising an integrated sensor element; and fastening the ASIC device to the dummy die, wherein the dummy die is unstructured and electrically inactive, wherein the ASIC device is fastened to the dummy die by an adhesive layer, wherein the ASIC device laterally overhangs the dummy die, wherein the sensor element is arranged on a portion of the ASIC device that laterally overhangs the dummy die, wherein the adhesive layer directly adjoins the ASIC device, and wherein the adhesive layer directly adjoins the dummy die. ### Claim 12 (depends on 11) The method according to claim 11, wherein a coefficient of thermal expansion of the dummy die is adapted to a coefficient of thermal expansion of the ASIC device. ### Claim 13 (depends on 11) The method according to claim 11, wherein the dummy die has smaller lateral dimensions than the ASIC device so that a lateral overhang is formed on at least one lateral side of the ASIC device. ### Claim 14 A method for producing a sensor package, the method comprising: providing a carrier including electric conductors; fastening an interposer to the carrier; providing an application specific integrated circuit (ASIC) device comprising an integrated sensor element; and fastening the ASIC device to the interposer, wherein the interposer is unstructured and electrically inactive, wherein the ASIC device is fastened to the interposer by an adhesive layer, wherein the ASIC device laterally overhangs the interposer, wherein the sensor element is arranged on a portion of the ASIC device that laterally overhangs the interposer, wherein the adhesive layer directly adjoins the ASIC device, and wherein the adhesive layer directly adjoins the interposer. ### Claim 15 (depends on 14) The method according to claim 14, wherein a coefficient of thermal expansion of the interposer is adapted to a coefficient of thermal expansion of the ASIC device. ### Claim 16 (depends on 14) The method according to claim 14, wherein the interposer has smaller lateral dimensions than the ASIC device so that a lateral overhang is formed on at least one lateral side of the ASIC device.