# US 12,179,395 B2 · Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,179,395 B2 - Document ID: US12179395B2 - Status: Granted - Kind: B2 - Application number: 17/489,806 - Filed: 2021-09-30 - Published: 2022-05-19 - Granted: 2024-12-31 - Earliest claimed: 2020-11-17 - Assignees: Apic Yamada Corporation - Applicants: Apic Yamada Corporation - Inventors: Makoto Kawaguchi; Masahiko Fujisawa; Yoshikazu Muramatsu; Minoru Hanazato - Web page: https://patentgrep.com/patent/US12179395B2 ## CPC - B29C 43/34: Feeding the material to the mould or the compression means {(B29C43/085 takes precedence)} - B29C 43/02: of articles of definite length, i.e. discrete articles {(B29C35/0227 takes precedence)} - B29C 43/18: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)} - B29C 43/58: Measuring, controlling or regulating {(for bank adjustment in calendering B29C43/245)} - B29C 2043/3433: {using dispensing heads, e.g. extruders, placed over or apart from the moulds} - B29C 2043/5875: {the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses} - B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece. ## Claims ### Claim 1 A resin supply apparatus for supplying a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively, the resin supply apparatus comprising: an acquisition unit configured to acquire an arrangement information of the elements on the workpiece by imaging the workpiece and analyzing the image of the workpiece; a supply unit configured to supply a resin onto the workpiece; a calculation unit configured to calculate a resin supply pattern by reading the registered arrangement information by the acquisition unit, and to calculate a desired moving pattern of the supply unit; and a drive unit configured to move at least one of the workpiece and the supply unit relative to the other along the resin supply pattern, wherein the resin supply pattern has a plurality of linear paths extending along the first direction, and a region between mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece. ### Claim 2 (depends on 1) The resin supply apparatus according to claim 1, wherein the plurality of linear paths extend parallel to the first direction. ### Claim 3 (depends on 1) The resin supply apparatus according to claim 1, wherein the plurality of linear paths have a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path, the first linear path is connected to the second linear path on one end side of the first direction, and the second linear path is connected to the third linear path on the other end side of the first direction. ### Claim 4 (depends on 1) The resin supply apparatus according to claim 1, wherein the resin supply pattern is one continuous linear line. ### Claim 5 (depends on 1) The resin supply apparatus according to claim 1, wherein at least one of the plurality of linear paths extends over a region between the elements adjacent in the second direction. ### Claim 6 (depends on 1) The resin supply apparatus according to claim 1, wherein at least one of the plurality of linear paths extends on the elements arranged in the first direction. ### Claim 7 (depends on 1) The resin supply apparatus according to claim 1, wherein at least one of the plurality of linear paths extends to an element at the outermost edge of the workpiece. ### Claim 8 (depends on 1) The resin supply apparatus according to claim 1, wherein the mutually adjacent linear paths in the plurality of linear paths extend to the elements on the inner side of the element at the outermost edge of the workpiece except for extending to the element at the outermost edge. ### Claim 9 (depends on 1) The resin supply apparatus according to claim 1, wherein the elements on the workpiece comprise two or more types of elements having different sizes, and the plurality of linear paths extend on elements on the workpiece that are smaller than the other elements. ### Claim 10 (depends on 1) The resin supply apparatus according to claim 1, wherein the supply unit is a dispenser that supplies a liquid resin. ### Claim 11 (depends on 1) A resin sealing apparatus comprising: the resin supply apparatus according to claim 1; and a resin sealing mold for sealing the elements on the workpiece with resin, the resin sealing mold has an upper mold provided with a cavity in which a resin is filled and a lower mold in which the workpiece is set, and the clamped resin sealing mold has a plurality of air vents for discharging air inside the cavity between the upper mold and the lower mold. ### Claim 12 (depends on 11) The resin sealing apparatus according to claim 11, wherein at least one of the plurality of air vents is arranged on an extension line of a region between the mutually adjacent linear paths in the plurality of linear paths. ### Claim 13 A resin supply apparatus for supplying, onto a release film, a resin used for sealing a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively, the resin supply apparatus comprising: an acquisition unit configured to acquire arrangement information of the elements on the workpiece by imaging the workpiece and analyzing the image of the workpiece; a supply unit configured to supply a resin onto the release film; a calculation unit configured to calculate a resin supply pattern by reading the registered arrangement information by the acquisition unit, and to calculate a desired moving pattern of the supply unit; and a drive unit configured to move at least one of the release film and the supply unit relative to the other along the resin supply pattern, wherein the resin supply pattern has a plurality of linear paths extending along the first direction, and a region between mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the release film. ### Claim 14 (depends on 13) A resin sealing apparatus comprising: the resin supply apparatus according to claim 13; and a resin sealing mold for sealing the elements on the workpiece with resin, wherein the resin sealing mold has a lower mold in which a cavity for filling a resin therein is arranged and the release film is set, and an upper mold in which the workpiece is set, and air vents for discharging air in the cavity are formed between the upper mold and the lower mold.