# US 12,179,285 B2 · Laser processing method and laser processing device and sealed type battery

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- Number: US 12,179,285 B2
- Document ID: US12179285B2
- Status: Granted
- Kind: B2
- Application number: 17/367,276
- Filed: 2021-07-02
- Published: 2022-02-10
- Granted: 2024-12-31
- Earliest claimed: 2020-08-06
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: Koji Funami
- Web page: https://patentgrep.com/patent/US12179285B2

## CPC

- B23K 26/244: Overlap seam welding
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/0652: {comprising prisms}
- B23K 26/067: Dividing the beam into multiple beams, e.g. multi-focusing
- B23K 26/0676: {into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations}
- B23K 26/083: {Devices involving movement of the workpiece in at least one axial direction}
- B23K 26/32: taking account of the properties of the material involved
- G02B 27/106: {for splitting or combining a plurality of identical beams or images, e.g. image replication}
- G02B 27/4233: {having a diffractive element [DOE] contributing to a non-imaging application (diffusers having a diffractive element G02B5/0252; filters having a diffractive element G02B5/203; systems for controlling the direction of light having diffractive elements G02B26/0808; scanning systems having diffractive elements G02B26/106; beam shaping systems using diffractive optical elements G02B27/0944; beam splitting or combining systems operating by diffraction G02B27/1086)}
- H01M 50/536: characterised by the method of fixing the leads to the electrodes, e.g. by welding
- H01M 50/566: by welding, soldering or brazing
- B23K 2101/34: Coated articles {; Surface treated articles}
- B23K 2101/36: Electric or electronic devices
- B23K 2103/12: Copper or alloys thereof
- Y02E 60/10: Energy storage using batteries
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

Provided is a laser processing method including overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction; branching a laser beam into a first branched laser beam and a second branched laser beam; irradiating the first plate-shaped member with the first branched laser beam and the second branched laser beam in a state where the first branched laser beam and the second branched laser beam are emitted in parallel; forming line-shaped melting portions on the first plate-shaped member by moving the branched laser beams in a direction intersecting a direction in which the branched laser beams are aligned; and joining overlapped plate-shaped members in a state where the melting portion formed by using the first branched laser beam and the melting portion formed by using the second branched laser beam are connected to each other in the second plate-shaped member and the melting portions do not penetrate the second plate-shaped member.

## Claims

### Claim 1

A laser processing method comprising:
overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction;
branching a laser beam into a plurality of branched laser beams that include a plurality of pairs of a first branched laser beam and a second branched laser beam;
irradiating the first plate-shaped member with the plurality of branched laser beams in a state where the plurality of branched laser beams are emitted in parallel;
forming line-shaped melting portions along a surface of the first plate-shaped member by relatively moving the first branched laser beam and the second branched laser beam with respect to the first plate-shaped member in a direction intersecting a direction in which the first branched laser beam and the second branched laser beam are aligned; and
joining each of the overlapped plate-shaped members with the line-shaped melting portions in a state where the melting portion formed by using the first branched laser beam and the melting portion formed by using the second branched laser beam are connected to each other in the second plate-shaped member and the melting portions do not penetrate the second plate-shaped member,
wherein in the first plate-shaped member, a gap between one pair of branched laser beams and another one pair of branched laser beams, which is adjacent to the one pair of branched laser beams, is larger than a gap between the first branched laser beam and the second branched laser beam.

### Claim 2 (depends on 1)

The laser processing method of claim 1, further comprising:
irradiating the first plate-shaped member with the branched laser beams such that the melting portions, which are formed by using the branched laser beams, are point-symmetrical or line-symmetrical with each other with respect to a center position on the surface of the first plate-shaped member.

### Claim 3 (depends on 1)

The laser processing method of claim 1, wherein the second plate-shaped member is made of a copper-based material that reduces absorption of the laser beam.