System and method for treating exhaust fluid from semiconductor manufacturing equipment

A system for treating exhaust fluid from semiconductor manufacturing equipment, the system comprising:

• a vacuum pump housing having a gas inlet formed at one side thereof, and a gas outlet formed at a remaining side thereof so as to be connected to a dry pump;
• a partition configured to divide an inner space of the vacuum pump housing into a front space configured to communicate with the gas inlet and a rear space configured to communicate with the gas outlet;
• a rotating shaft rotatably installed within the front space and the rear surface of the vacuum pump housing;
• a plurality of main rotors mounted on the rotating shaft and disposed in the front space;
• a plurality of subsidiary rotors mounted on the rotating shaft and disposed in the rear space;
• a motor connected to the rotating shaft;
• an inverter configured to control driving of the motor;
• a plasma apparatus connected to the front space via a first connection pipe so as to communicate with the front space, and connected to the rear space via a second connection pipe so as to communicate with the rear space;
• a bypass pipe configured to connect the plasma apparatus to the gas inlet of the vacuum pump housing;
• an opening and closing valve mounted on the bypass pipe;
• and
• a controller configured to control a motor rotational speed through the inverter and to open and close the opening and closing valve on a designated cycle.