# US 12,178,648 B2 · Methods and apparatuses for packaging an ultrasound-on-a-chip

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- Number: US 12,178,648 B2
- Document ID: US12178648B2
- Status: Granted
- Kind: B2
- Application number: 17/853,835
- Filed: 2022-06-29
- Published: 2022-12-15
- Granted: 2024-12-31
- Earliest claimed: 2018-01-30
- Assignees: Bfly Operations, Inc.
- Applicants: BFLY Operations, Inc.
- Inventors: Keith G. Fife; Jianwei Liu; Andrew Betts
- Web page: https://patentgrep.com/patent/US12178648B2

## CPC

- A61B 8/4483: {characterised by features of the ultrasound transducer}
- A61B 8/54: {Control of the diagnostic device}
- A61B 8/56: {Details of data transmission or power supply}
- B06B 1/0292: {Electrostatic transducers, e.g. electret-type}
- B06B 1/0622: {on one surface}
- B81B 7/0048: {between the MEMS die and the substrate}
- B81C 1/00261: {Processes for packaging MEMS devices (MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023)}
- B06B 2201/76: Medical, dental
- G01N 29/0672: {by acoustic tomography (medical tomography A61B8/13)}
- G01N 29/24: Probes {(transducers for acoustic waves B06B, G10K; for measuring G01H)}
- H10N 30/03: Assembling devices that include piezoelectric or electrostrictive parts
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W 70/635: {Through-vias}
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

## Claims

### Claim 1

A portable ultrasound imaging device, comprising:
a hand-held ultrasound probe; and
an ultrasound-on-a-chip package housed in the handheld ultrasound probe, the ultrasound-on-a-chip package comprising:
an ultrasound-on-a-chip; and
an interposer coupled to the ultrasound-on-a-chip, the interposer comprising:
a plurality of first vias electrically coupled to the ultrasound-on-a-chip; and
a plurality of second vias different than the plurality of first vias and configured to conduct heat away from the ultrasound-on-a-chip.

### Claim 2 (depends on 1)

The portable ultrasound imaging device of claim 1, wherein the plurality of second vias are coupled to copper patterns disposed on a face of the interposer and protruding towards the ultrasound-on-a-chip from the face of the interposer.

### Claim 3 (depends on 1)

The portable ultrasound imaging device of claim 1, wherein an adhesive is disposed along a portion of an interface between the ultrasound-on-a-chip and the interposer.

### Claim 4 (depends on 1)

The portable ultrasound imaging device of claim 1, wherein a thermally conductive material is disposed along a portion of an interface between the ultrasound-on-a-chip and the interposer.

### Claim 5 (depends on 1)

The portable ultrasound imaging device of claim 1, wherein a thickness of the ultrasound-on-a-chip is about 200 microns to 300 microns.

### Claim 6 (depends on 1)

The portable ultrasound imaging device of claim 1, wherein vias of the plurality of first vias are electrically coupled to the ultrasound-on-a-chip by wirebonds.

### Claim 7 (depends on 1)

The portable ultrasound imaging device of claim 1, wherein the ultrasound-on-a-chip and the interposer are coupled together using a surface-mount technology (SMT) process.

### Claim 8 (depends on 1)

The portable ultrasound imaging device of claim 1, further comprising a printed circuit board comprising circuitry and/or traces, the printed circuit board being coupled to the interposer such that the plurality of first vias in the interposer are electrically connected to the circuitry and/or traces in the printed circuit board.

### Claim 9

A portable ultrasound imaging device, comprising:
a hand-held ultrasound probe; and
an ultrasound-on-a-chip package housed in the hand-held ultrasound probe, the ultrasound-on-a-chip package comprising:
an ultrasound-on-a-chip including first bond pads;
an interposer comprising second bond pads and coupled to the ultrasound-on-a-chip; and
wirebonds extending from the first bond pads on the ultrasound-on-a-chip to the second bond pads on the interposer.

### Claim 10 (depends on 9)

The portable ultrasound imaging device of claim 9, the interposer further comprising:
a plurality of first vias electrically coupled to the second bond pads; and
a plurality of second vias different than the plurality of first vias and configured to conduct heat away from the ultrasound-on-a-chip.

### Claim 11 (depends on 10)

The portable ultrasound imaging device of claim 10, wherein the plurality of second vias are coupled to copper patterns disposed on a face of the interposer and protruding towards the ultrasound-on-a-chip from the face of the interposer.

### Claim 12 (depends on 10)

The portable ultrasound imaging device of claim 10, wherein an empty space exists along a portion of an interface between the ultrasound-on-a-chip and the interposer.

### Claim 13 (depends on 10)

The portable ultrasound imaging device of claim 10, wherein an adhesive is disposed along a portion of an interface between the ultrasound-on-a-chip and the interposer.

### Claim 14 (depends on 10)

The portable ultrasound imaging device of claim 10, wherein a thermally conductive material is disposed along a portion of an interface between the ultrasound-on-a-chip and the interposer.

### Claim 15 (depends on 10)

The portable ultrasound imaging device of claim 10, further comprising a printed circuit board comprising circuitry and/or traces, and wherein the printed circuit board is coupled to the interposer such that the plurality of first vias in the interposer are electrically connected to the circuitry and/or traces in the printed circuit board.