Mask, method of manufacturing the same, and method of manufacturing display panel

A method of manufacturing a mask, the method comprising:

• forming a first mask layer;
• forming a second mask layer on the first mask layer;
• forming a photoresist pattern layer on the second mask layer;
• removing a first area of the second mask layer, which is exposed through the photoresist pattern layer;
• defining an opening through the first mask layer;
• removing a portion of the photoresist pattern layer and exposing a portion of a second area of the second mask layer;
• and
• removing the portion of the second area of the second mask layer,
• wherein the forming the photoresist pattern layer comprises:
• forming a photoresist layer on the second mask layer;
• disposing an exposure mask comprising a first mask area having a first transmittance, a second mask area having a second transmittance smaller than the first transmittance, and a third mask area having a third transmittance smaller than the second transmittance, which are defined therein, on the photoresist layer;
• and
• patterning the photoresist layer using the exposure mask, and wherein the second mask area is spaced apart from the first mask area with the third mask area interposed therebetween.

A method of manufacturing a display panel, comprising:

• forming a mask through which a through-hole is defined, the forming the mask comprising:
• forming a first mask layer;
• forming a second mask layer on the first mask layer;
• forming a photoresist pattern layer in which a photo opening and a groove surrounding the photo opening are defined on the second mask layer;
• removing a first area of the second mask layer, which overlaps the photo opening;
• etching a portion of the first mask layer and a portion of the photoresist pattern layer;
• and
• etching a second area of the second mask layer exposed through the etched groove;
• preparing a target substrate;
• disposing the mask on the target substrate;
• forming a light emitting pattern in a light emitting area of the target substrate corresponding to the through-hole;
• and
• removing the mask.