Module
AssigneeMurata Manufacturing Co., Ltd.
InventorsTadashi Nomura, Ryoichi Kita
Life of this patent
Estimating the term…
Abstract
A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.
Claims15
A module comprising:
- a substrate having a first surface;
- a first component mounted on the first surface;
- a first protruding electrode disposed on the first surface;
- a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode;
- and a first shield film provided to overlap with the first resin film, wherein the first protruding electrode includes a first sharpened portion, in at least a part of the first sharpened portion, the first protruding electrode is exposed from the first resin film, and the first shield film is electrically connected to the first protruding electrode by covering a portion of the first protruding electrode exposed from the first resin film;
- and the first protruding electrode further includes a flat portion extended along the first surface and adjacent to a blade shape;
- and the flat portion is also exposed from the first resin film, and the first shield film is electrically connected to the first protruding electrode in the flat portion.
Dependencies are inferred from the claim text.