US 12,176,473 B1Granted

LED packaging structure

OwnerPeng Wang, Jueming Liinventors

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Abstract

The present disclosure discloses a light-emitting diode (LED) packaging structure, including a bracket, wherein at least two rectifier chips are mounted on the bracket; an internal circuit and a voltage reduction resistor are mounted on the bracket; at least one light-emitting chip is also mounted on the bracket; the light-emitting chip is connected in parallel or series with the rectifier chips through metal wires to form an internal rectifier circuit; and the internal rectifier circuit is formed into a complete internal circuit through voltage reduction or current-limiting protection of the voltage reduction resistor. The LED packaging structure of the present disclosure can make an LED to emit light when driven directly by alternating current power, so that the LED packaging structure can be better used in fields such as product assembling, product application, and product cost, and more resources can be saved.

Claims12

Dependent claims

A light-emitting diode (LED) packaging structure, comprising a bracket (4), wherein at least two rectifier chips (1) are mounted on the bracket (4), and an internal circuit and a voltage reduction resistor (2) are mounted on the bracket (4);

at least one light-emitting chip (3) is also mounted on the bracket (4);
the light-emitting chip (3) is connected in parallel or series with the rectifier chips (1) through metal wires to form an internal rectifier circuit;
and the internal rectifier circuit is formed into a complete internal circuit through voltage reduction or current-limiting protection of the voltage reduction resistor (2);
and
wherein the bracket (4) is arranged in a long strip shape, and two groups of rectifier chips (1) are mounted on two sides of an upper end of the bracket (4);
the voltage reduction resistor (2) is also mounted on one side of the bracket ((4);
there are a plurality of light-emitting chips (3);
the plurality of light-emitting chips (3) are connected in parallel or series with the rectifier chips (1) through the metal wires to form the internal rectifier circuit;
and bonding pads of the various chips in the bracket (4) are connected in parallel or series.

6 more elements

Dependencies are inferred from the claim text.