Transformer guard trace
AssigneeTexas Instruments Incorporated
InventorVijaylaxmi Gumaste Khanolkar
Life of this patent
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Abstract
An electronic device includes first leads along a first side, second leads along a second side, first and second dies, and a magnetic assembly with a multilevel lamination structure with first and second windings and a conductive guard trace. The lamination structure includes the first winding in a first level, and the second winding in a different level. The guard trace is between the first patterned conductive feature and the second side of the package structure. A first set of electrical connections couple the first die, the first winding, and one of the first conductive leads in a first circuit, and a second set of electrical connections couple the second die, the second winding, the guard trace and one of the second conductive leads in an isolated second circuit.
Claims29
A packaged electronic device, comprising:
- first conductive leads along a first side of a package structure;
- second conductive leads along a second side of the package structure;
- a first semiconductor die attached to a first die attach pad;
- a second semiconductor die attached to a second die attach pad;
- a magnetic assembly attached to a support structure in the package structure, the magnetic assembly including:
- a multilevel lamination structure, including:
- a first patterned conductive feature having multiple turns in a first level to form a first winding, a second patterned conductive feature having multiple turns in a different level to form a second winding, and a conductive guard trace spaced apart from and between the first patterned conductive feature and the second side of the package structure;
- a first core structure attached to a first side of the multilevel lamination structure;
- and
- a second core structure attached to a second side of the multilevel lamination structure;
- a first set of electrical connections that couple the first semiconductor die, the first patterned conductive feature, and at least one of the first conductive leads in a first circuit;
- and
- a second set of electrical connections that couple the second semiconductor die, the second patterned conductive feature, the conductive guard trace, and at least one of the second conductive leads in a second circuit isolated from the first circuit.
A magnetic assembly, comprising:
- a multilevel lamination structure, including:
- a first side;
- a second side spaced apart from the first side along a first direction;
- a third side;
- a fourth side spaced apart from the third side along a second direction, the second direction being perpendicular to the first direction;
- a first patterned conductive feature having multiple turns in a first level to form a first winding;
- a second patterned conductive feature having multiple turns in a different level to form a second winding;
- and
- a conductive guard trace spaced apart from and between the first patterned conductive feature and the second side of the multilevel lamination structure;
- a first core structure attached to the first side of the multilevel lamination structure;
- and
- a second core structure attached to the second side of the multilevel lamination structure.
A packaged electronic device, comprising:
- first conductive leads along a first side of a package structure;
- second conductive leads along a second side of the package structure;
- a first semiconductor die attached to a first die attach pad;
- a second semiconductor die attached to a second die attach pad;
- a magnetic assembly attached to a support structure in the package structure, the magnetic assembly including:
- a multilevel lamination structure, including:
- a first patterned conductive feature having multiple turns in a first level to form a first winding, a second patterned conductive feature having multiple turns in a different level to form a second winding, and a conductive guard trace spaced apart from and between the first patterned conductive feature and the second side of the package structure;
- a first set of electrical connections that couple the first semiconductor die, the first patterned conductive feature, and at least one of the first conductive leads in a first circuit;
- and
- a second set of electrical connections that couple the second semiconductor die, the second patterned conductive feature, the conductive guard trace, and at least one of the second conductive leads in a second circuit isolated from the first circuit.
A multilevel lamination structure, comprising:
- a first side;
- a second side spaced apart from the first side along a first direction;
- a third side;
- a fourth side spaced apart from the third side along a second direction, the second direction being perpendicular to the first direction;
- a first patterned conductive feature having multiple turns in a first level to form a first winding;
- a second patterned conductive feature having multiple turns in a different level to form a second winding;
- and
- a conductive guard trace spaced apart from and between the first patterned conductive feature and the second side of the multilevel lamination structure.
Dependencies are inferred from the claim text.