Semiconductor devices and methods of manufacturing semiconductor devices

A semiconductor device, comprising:

• a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• and
• a conductive structure;
• an electronic component comprising:
• an electronic component first side;
• an electronic component second side opposite to the electronic component first side;
• and
• an electronic component lateral side connecting the electronic component first side to the electronic component second side;
• wherein the electronic component second side is coupled to the conductive structure;
• a guide structure over the substrate first side and comprising:
• a guide base;
• and
• a plurality of first guide rails extending from a first side of the guide base and in a first direction toward the electronic lateral side without extending laterally underneath the electronic component;
• and
• an underfill interposed between the electronic component second side and the substrate first side, wherein the underfill is over the guide structure.

A method of forming an electronic device, comprising:

• providing a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• and
• a conductive structure comprising internal terminals over the substrate first side;
• providing a guide structure over the substrate first side and comprising:
• a guide base over the substrate first side;
• a first guide rail extending in a first direction from a first side of the guide base;
• and
• a second guide rail extending in the first direction from the first side of the guide base and separated from the first guide rail;
• coupling an electronic component to the substrate, the electronic component comprising:
• an electronic component first side;
• an electronic component second side opposite to the electronic component first side;
• and
• an electronic component lateral side connecting the electronic component first side to the electronic component second side and defining an electronic component perimeter;
• wherein:
• the electronic component second side is coupled to one or more of the internal terminals;
• and
• the electronic component lateral side does not laterally overlap the guide base and does not laterally overlap the second guide rail;
• and
• providing an underfill using the guide structure to guide the underfill extending underneath the electronic component, wherein the underfill remains over the guide structure.