System, method and device for temperature control

A device for temperature control, applied to a semiconductor machine, comprising:

• an acquisition circuit, configured to acquire a present temperature of a reaction window in a process chamber of the semiconductor machine;
• a temperature comparison circuit, configured to compare the present temperature with a preset temperature to acquire a comparison result;
• and
• an adjustment circuit, configured to adjust an exhaust amount of an exhaust passage of the process chamber based on the comparison result, to control a temperature of the reaction window;
• wherein the acquisition circuit is configured to acquire the present temperature of the reaction window in the process chamber of the semiconductor machine based on:
• acquiring a working state of a heating assembly of the reaction window in the semiconductor machine;
• reducing the opening degree of the exhaust valve to be fully closed in case that the working state of the heating assembly is turned off;
• and
• acquiring a present temperature of the reaction window in the process chamber of the semiconductor machine in case that the working state of the heating assembly is turned on;
• and
• wherein the adjustment circuit is configured to adjust the exhaust amount of the exhaust passage of the process chamber based on the comparison result, to control the temperature of the reaction window by adjusting the exhaust amount of the exhaust passage of the process chamber and an output power of the heating assembly based on the comparison result, to control the temperature of the reaction window;
• wherein the exhaust passage of the process chamber is provided with an exhaust valve;
• and
• wherein the adjustment circuit is further configured to:
• adjust an opening degree of the exhaust valve based on the comparison result.

A system for temperature control, applied to a semiconductor machine, comprising:

• a temperature sensing assembly, a control assembly, an exhaust adjusting assembly, and a heating assembly, wherein
• the temperature sensing assembly is arranged on a reaction window of a process chamber of the semiconductor machine, and configured to sense a temperature of the reaction window;
• the control assembly is connected with the temperature sensing assembly, and configured to:
• acquire a present temperature of the reaction window from the temperature sensing assembly;
• compare the present temperature with a preset temperature to acquire a comparison result;
• and control the exhaust adjusting assembly to adjust an exhaust amount of an exhaust passage of the process chamber based on the comparison result, to control the temperature of the reaction window;
• and
• the exhaust adjusting assembly is arranged on the exhaust passage of the process chamber, connected with the control assembly, and configured to control the exhaust amount of the exhaust passage;
• the heating assembly is arranged in the process chamber, and configured to heat the reaction window, wherein
• the control assembly is further configured to:
• acquire a working state of the heating assembly;
• reducing the opening degree of the exhaust valve to be fully closed in case that the working state of the heating assembly is turned off, and acquire a present temperature of the reaction window in the process chamber of the semiconductor machine in case that the working state of the heating assembly is turned on;
• and
• wherein the exhaust adjusting assembly comprises a driving motor and an exhaust valve of the exhaust passage, wherein
• the driving motor is configured to drive the exhaust valve to control an opening degree of the exhaust valve.