Package expanded beam connector for on-package optics
AssigneeIntel Corporation
InventorsWesley Morgan, Srikant Nekkanty, Todd R. Coons, Gregorio R. Murtagian, Xiaoqian Li, Nitin Deshpande, Divya Pratap
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.
Claims25
A photonics package, comprising:
- a package substrate, wherein the package substrate comprises a cutout along an edge of the package substrate;
- a photonics die coupled to the package substrate, wherein the photonics die overhangs the cutout;
- and
- a receptacle for receiving a pluggable optical connector, wherein the receptacle is over the cutout.
A pluggable optical connector, comprising:
- a plug housing, wherein the plug housing has an alignment notch to separate a first portion of the plug housing from a second portion of the plug housing, wherein the plug housing is adapated to plug into a plug receptical over a cutout in a package substrate, wherein a photonics die coupled to the package substrate overhangs the cutout;
- first optical fibers in the first portion of the plug housing;
- second optical fibers in the second portion of the plug housing;
- a latching feature over a first surface of the plug housing;
- and
- a spring affixed to a second surface of the plug housing.
A photonics package, comprising:
- a board;
- a package substrate coupled to the board by a socket, wherein the package substrate comprises a cutout along an edge of the package substrate;
- a photonics die coupled to the package substrate, wherein the photonics die overhangs the cutout;
- and
- a plug receptacle integrated into the socket, wherein the plug receptacle is configured to receive an optical connector for interfacing with the photonics die.
Dependencies are inferred from the claim text.