Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly

A method of providing a conductive bridge in a piezoelectric micro-electro-mechanical system (MEMS) scanning mirror system, the method comprising:

• dispense a bottom structural adhesive on a first structural connection comprising a substrate to cause the substrate to become structurally connected to the bottom structural adhesive and the bottom structural adhesive to become structurally connected to a bottom surface of a actuator frame creating a mechanical bond between the actuator frame and the substrate;
• dispense a partially conductive adhesive on the actuator frame;
• place one or more piezoelectric materials on the actuator frame;
• and
• dispense a conductive adhesive on the mechanical bond to enable an electrical connection between a top surface of the actuator frame and the substrate.

A head mounted display (HMD) device comprising a piezoelectric micro-electro-mechanical system (MEMS) scanning mirror system including a conducting bridge, the system comprising:

• an actuator frame consisting of a frame material;
• at least one actuator having a top electrode on a top surface of the at least one actuator and a bottom electrode on a bottom surface of the at least actuator, the at least one actuator attached to a top surface of the actuator frame with a partially conductive adhesive;
• a mirror extending across a gap in a central mounting member of the actuator frame and attached with a top structural adhesive via anchor portions of the mirror to the top surface of the actuator frame;
• a structural connection comprising a substrate structurally connected to a bottom structural adhesive and the bottom structural adhesive structurally connected to bottom surface of the actuator frame creating a mechanical bond between the actuator frame and the substrate;
• and
• a trace of conductive adhesive enabling an electrical connection between the top surface of the actuator frame and the substrate.