# US 12,173,201 B2 · Copper-clad laminate and method of forming the same

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- Number: US 12,173,201 B2
- Document ID: US12173201B2
- Status: Granted
- Kind: B2
- Application number: 17/643,452
- Filed: 2021-12-09
- Published: 2022-06-23
- Granted: 2024-12-24
- Earliest claimed: 2020-12-16
- Assignees: Versiv Composites Limited
- Applicants: Versiv Composites Limited
- Inventors: Jennifer Adamchuk; Dale Thomas; Meghann White; Sethumadhavan Ravichandran; Gerard T. Buss
- Web page: https://patentgrep.com/patent/US12173201B2

## CPC

- C09J 7/29: Laminated material (metallised plastics C09J7/22)
- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- C09J 7/381: {based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds}
- C09J 11/04: inorganic
- H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/41: additives as essential feature of the carrier layer
- C09J 2400/166: in the pretreated surface to be joined
- C09J 2427/00: Presence of halogenated polymer
- C09J 2427/006: in the substrate
- H05K 1/034: {containing halogen}
- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H05K 2201/0191: wherein the thickness of the dielectric plays an important role
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0266: Size distribution
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

## Claims

### Claim 1

A copper-clad laminate comprising:
a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material,
wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.

### Claim 2 (depends on 1)

The copper-clad laminate of claim 1, wherein the fluoropolymer based adhesive layer has an average thickness of at least about 0.2 microns and not greater than about 7 microns.

### Claim 3 (depends on 1)

The copper-clad laminate of claim 1, wherein the fluoropolymer based adhesive layer is a perfluoroalkoxy polymer resin layer.

### Claim 4 (depends on 1)

The copper-clad laminate of claim 1, wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D90−D10)/D50, where D90 is equal to a D90 particle size distribution measurement of the first filler material, D10 is equal to a D10 particle size distribution measurement of the first filler material, and D50 is equal to a D50 particle size distribution measurement of the first filler material.

### Claim 5 (depends on 1)

The copper-clad laminate of claim 1, wherein the first filler material comprises a silica based compound.

### Claim 6 (depends on 1)

The copper-clad laminate of claim 1, wherein the first filler material comprises silica.

### Claim 7 (depends on 1)

The copper-clad laminate of claim 1, wherein the resin matrix comprises a perfluoropolymer.

### Claim 8 (depends on 1)

The copper-clad laminate of claim 1, wherein the content of the resin matrix component is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating.

### Claim 9 (depends on 7)

The copper-clad laminate of claim 7, wherein the content of the perfluoropolymer is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating.

### Claim 10 (depends on 1)

The copper-clad laminate of claim 1, wherein the content of the ceramic filler component is at least about 30 vol. % and not greater than about 57 vol. % for a total volume of the dielectric coating.

### Claim 11 (depends on 1)

The copper-clad laminate of claim 1, wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the ceramic filler component.

### Claim 12 (depends on 1)

The copper-clad laminate of claim 1, wherein the dielectric coating comprises a dissipation factor (5 GHZ, 20% RH) of not greater than about 0.005.

### Claim 13

A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material,
wherein the dielectric coating has an average thickness of not greater than 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.

### Claim 14 (depends on 13)

The printed circuit board of claim 13, wherein the fluoropolymer based adhesive layer is a perfluoroalkoxy polymer resin layer.

### Claim 15 (depends on 13)

The printed circuit board of claim 13, wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D90−D10)/D50, where D90 is equal to a D90 particle size distribution measurement of the first filler material, D10 is equal to a D10 particle size distribution measurement of the first filler material, and D50 is equal to a D50 particle size distribution measurement of the first filler material.

### Claim 16 (depends on 13)

The printed circuit board of claim 13, wherein the first filler material comprises a silica based compound.

### Claim 17 (depends on 13)

The printed circuit board of claim 13, wherein the first filler material comprises silica.

### Claim 18 (depends on 13)

The printed circuit board of claim 13, wherein the resin matrix comprises a perfluoropolymer.

### Claim 19 (depends on 13)

The printed circuit board of claim 13, wherein the content of the resin matrix component is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating.

### Claim 20

A method of forming a copper-clad laminate, wherein the method comprises:
providing a copper foil layer,
applying a fluoropolymer based adhesive layer overlying the copper foil layer,
combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture,
forming the forming mixture into a dielectric coating overlying the fluoropolymer based adhesive layer,
wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.