Feedthroughs for enclosures in deep water vessels

An enclosure structure suitable for high-pressure environments, the enclosure structure comprising:

• a circuit board assembly comprising one or more circuit components mounted on a surface of a circuit board;
• and
• a housing configured to distribute pressure positioned over the circuit board assembly, wherein the housing comprises:
• one or more areas conforming to and in contact with one or more corresponding sections of the surface, and
• one or more cavities, each cavity configured to receive one of the one or more circuit components, the one or more cavities comprising a first cavity having a first volume larger than a volume of a corresponding first circuit component of the one or more circuit components so as to create a first gap between the housing and the first circuit component,
• the enclosure structure having a feedthrough for coupling one or more circuit components housed within the enclosure structure to components external to the enclosure structure;
• a bore through the housing, wherein the bore comprises a non-tapered portion and a tapered portion, the non-tapered portion being proximate to an interior of the housing and the tapered portion being proximate to an exterior of the housing, and wherein the bore is configured to receive a feedthrough pin for coupling a connector element of one or more circuit components to an external component external to the enclosure structure;
• and
• a feedthrough pin extending through the bore, the feedthrough pin having a first end and a second end, wherein the first end is configured to be coupled to the connector element and the second end is configured to be coupled to the external component.