Nail polish application and solidification apparatus

An apparatus for nail polish application and solidification, comprising:

• at least one nail polish applying element configured to apply nail polish;
• at least one actuator;
• at least one solidifying energy source configured to solidify nail polish;
• at least one nail polish removal element configured to remove nail polish;
• at least one imaging sensor configured to capture sensory data depicting a treatment space;
• a light masking screen deployed between the at least one solidifying energy source and the treated space, the light masking screen is configured to limit solidifying light emitted from the at least one solidifying energy source to project on a limited surface area;
• and
• at least one processor executing a code for:
• analyzing the sensory data to identify at least one nail surface of at least one finger,
• calculating instructions for operating the at least one nail polish applying element to crudely apply nail polish on the at least one nail surface,
• calculating instructions for operating the at least one actuator for moving the light masking screen according to an analysis of the sensory data such that solidifying light transferred by the light masking screen is projected only within a boundary of the at least one nail surface;
• calculating instructions for operating the at least one solidifying energy source to solidify the nail polish applied on the at least one nail surface, and
• calculating instructions for operating the at least one nail polish removal element to remove nail polish residues applied on skin of the at least one finger surrounding at least partially the boundary of the at least one nail surface while avoiding removing the nail polish applied within the boundary.