Four-point tilt alignment wafer chuck

Abstract

An apparatus includes a chuck configured to hold a wafer and a tilt plate disposed beneath the chuck and adjustably connected to the chuck by a pair of upper screws and a pair of lower screws separately arranged in opposite corners of the chuck. Screw heads of the pair of upper screws rest against a top surface of the chuck, such that clockwise rotation of one of the upper screws pushes a corresponding corner of the chuck toward the tilt plate. Screw heads of the pair of lower screws rest against a bottom surface of the chuck, such that counter-clockwise rotation of one of the lower screws pushes a corresponding corner of the chuck away from the tilt plate.

Dependencies are inferred from the claim text.