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US 12,172,242 B2Granted
Lead-free solder alloy
AssigneeNihon Superior Co., Ltd.
InventorsTakatoshi Nishimura, Tetsuro Nishimura, Tetsuya Akaiwa
Life of this patent
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Abstract
A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.
Claims12
A lead-free solder alloy consisting of:
- Ag in an amount of 0.3 to 4.0% by mass;
- Cu in an amount of 0.1 to 2.0% by mass;
- Fe in an amount of 0.005 to 0.05% by mass;
- Ni in an amount of 0.01 to 0.5% by mass;
- Ga in an amount of 0.005 to 0.1% by mass;
- at least one selected from P, Ti, Mo, Zr, and Mn, wherein a content of each of P, Ti, Mo, Zr, and Mn is 0.001 to 0.1% by mass;
- and
- Sn as a balance.
5 more elements
A lead-free solder alloy consisting of:
- Ag in an amount of 0.3 to 4.0% by mass;
- Cu in an amount of 0.1 to 2.0% by mass;
- Fe in an amount of 0.005 to 0.05% by mass;
- Ni in an amount of 0.01 to 0.5% by mass;
- Ga in an amount of 0.005 to 0.1% by mass;
- and
- Sn as a balance.
4 more elements
Dependencies are inferred from the claim text.