Electronic device and method for manufacturing electronic device

An electronic device comprising:

• a housing that is formed of a resin member having a predetermined light absorption property and that has an opening;
• a circuit board that is accommodated in the housing and on which an electronic circuit is formed;
• at least one terminal that includes one end portion and the other end portion, the other end portion being electrically connected to the circuit board;
• and
• a cover portion that covers the opening of the housing, that is penetrated by the at least one terminal, and that is formed of a resin member having a predetermined light transmitting property,
• wherein the one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion,
• wherein the cover portion is molded at a mold temperature of 100 degrees Celsius to 180 degrees Celsius,
• wherein the at least one terminal and the circuit board are electrically connected to each other by solder joining,
• wherein the housing and the cover portion are connected to each other by laser welding, and
• wherein a light transmitting property of the cover portion is higher than a light transmitting property of the housing.