Exposure control in photolithographic direct exposure methods for manufacturing circuit boards or circuits

A method for exposure control in photolithographic direct exposure of two-dimensional structures in photosensitive coatings on a substrate having the following steps:

• arranging a plurality of entocentric cameras to form a gapless linear scanning area transverse to a movement direction of the substrate in a registration unit for detecting target marks located on the substrate, wherein the entocentric cameras have angles of view extending along the linear scanning area with an overlapping region formed by adjacent entocentric cameras in order to obtain redundant image captures of the substrate in the overlapping region from the adjacent entocentric cameras,
• moving the substrate on a movable table system in a defined one-dimensional movement below the registration unit,
• providing a processing unit for the photolithographic production of two-dimensional structures with a processing beam which is controllable along a linear processing path,
• detecting a spatial position with respect to length position, width position and a height position of target marks arbitrarily distributed over a given width of the substrate during one pass of the substrate through the linear scanning area of the registration unit,
• determining the positions of the target marks arbitrarily distributed over the width of the substrate from the redundant image captures in the overlapping region of the adjacent entocentric cameras additionally using a height position of the target marks which is determined from the redundant image captures of the adjacent entocentric cameras by means triangulation of a distance of the substrate surface,
• calculating data for alignment and local adjustment of the processing of the substrate with two-dimensional structures for the processing unit for controlling the processing beam along the linear processing path which is oriented transverse to the movement direction of the substrate, and
• controlling the alignment between the linear processing path and the substrate and local adjustment of the photolithographic processing depending on a position of the substrate determined by means of registered target marks.