Plasma processing apparatus and method for using plasma processing apparatus

A method for using a plasma processing apparatus, the plasma processing apparatus including:

• a chamber having an opening at a top;
• a stage provided in the chamber, the stage for placing an object to be processed;
• a dielectric member closing the opening;
• a cover installed so as to cover the dielectric member inside the chamber;
• a gas introduction path formed between the dielectric member and the cover;
• and
• an induction coil provided above the dielectric member,
• the induction coil including a first induction coil installed so as to overlap a central region of the dielectric member, and a second induction coil installed so as to overlap a peripheral region outside the central region of the dielectric member,
• the cover having a first gas hole formed at a position overlapping the central region of the dielectric member and a second gas hole formed at a position overlapping the peripheral region of the dielectric member,
• the gas introduction path having a first gas introduction path communicating with the first gas hole and a second gas introduction path communicating with the second gas hole, the method comprising:
• generating a plasma containing a source gas in the chamber, by introducing the source gas into the first and second gas introduction paths and applying a high-frequency power to the first and second induction coils.