Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, and compound
AssigneeFUJIFILM Corporation
InventorsTaro Miyoshi, Yasunori Yonekuta, Eiji Fukuzaki
Life of this patent
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Abstract
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a solubility in an alkali developer that increases through decomposition by an action of an acid and (B) a compound that generates an acid upon irradiation with actinic rays or radiation and is represented by a specific structure; an actinic ray-sensitive or radiation-sensitive film using the composition; a pattern forming method; a method for manufacturing an electronic device; and a compound.
Claims9
An actinic ray-sensitive or radiation-sensitive resin composition comprising the following (A) and (B):
- (A) a resin having a solubility in an alkali developer that increases through decomposition by an action of an acid;
- and
- (B) a compound that generates an acid upon irradiation with actinic rays or radiation and is represented by General Formula (1),
- in General Formula (1), R1 and R5 each independently represent an aryl group or a heteroaryl group, R2 to R4 each independently represent a hydrogen atom or a substituent, Mn+ represents a cation, and n represents an integer of 1 or more;
- wherein the content of the resin (A) in the actinic ray-sensitive or radiation-sensitive resin composition is 20 to 99.5 mass % and the content of the compound (B) in the actinic ray-sensitive or radiation-sensitive resin composition is 0.1 to 35 mass %, with respect to the total solids content of the composition;
- and wherein the actinic ray-sensitive or radiation-sensitive resin composition does not include a compound which generates an acid with a pKa lower than the acid generated by the compound (B).
Dependencies are inferred from the claim text.