Removing filling material from a cavity in a component and apparatus for performing same
AssigneeSiemens Aktiengesellschaft
InventorChristoph Kiener
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AssigneeSiemens Aktiengesellschaft
InventorChristoph Kiener
Estimating the term…
Various embodiments may include a method for removing filling material from a cavity in a manufactured component with a connection from the cavity opening to surroundings of the component, the method comprising: holding the component in a movable mounting; moving the component and at the same time removing the filling material through the connection opening; and executing a computer program with a processor, wherein the computer program instructs the processor to: analyze geometry data of the component including the connection opening; and calculate a necessary positioning of the component, based on the geometry data and gravitational force; and direct the movable mounting through a sequence of movements for moving the component in space to spill the filling material from the cavity through the connection opening out of the component.
A method for removing filling material from a cavity in a manufactured component with a connection from the cavity opening to surroundings of the component, the method comprising:
A device comprising:
A production unit comprising:
Dependencies are inferred from the claim text.