Heatpipe to help reduce radio frequency interference
AssigneeIntel Corporation
InventorsKae-An Liu, Jaejin Lee, David W. Browning
Life of this patent
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Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.
Claims18
An electronic device comprising:
- a substrate;
- and
- a heat pipe wherein the heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate, wherein a first subset of the plurality of bumps has a bump to substrate gap and a second subset of the plurality of bumps has a bump to chassis gap and the bump to substrate gap is different than the bump to chassis gap.
An electronic device comprising:
- a chassis;
- a substrate;
- an antenna, wherein the antenna is sensitive to radio frequency interference;
- a heat source on the substrate, wherein the heat source produces radio frequency interference;
- and
- a heat pipe coupled to the heat source, wherein the heat pipe includes a plurality of bumps that extend from the heat pipe towards the chassis but do not come into contact with the chassis, wherein a first portion of the plurality of bumps has a bump to substrate gap and a second portion of the plurality of bumps has a bump to chassis gap and the bump to substrate gap is the same as the bump to chassis gap.
A method comprising:
- determining that a heat pipe is a cause of radio frequency interference;
- determining a configuration of bumps along the heat pipe that will mitigate the radio frequency interference;
- and
- creating the heat pipe with a plurality of radio frequency interference reducing bumps to reduce the radio frequency interference from the heat pipe, wherein a first portion of the heat pipe includes a first portion of the plurality of radio frequency interference reducing bumps with a bump to substrate gap and a second portion of the heat pipe includes a second portion of the plurality of radio frequency interference reducing bumps with a bump to chassis gap and the bump to substrate gap is different than the bump to chassis gap.
Dependencies are inferred from the claim text.