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US 12,157,801 B2Granted
Strong adhesion of conducting polymers on diverse substrates
AssigneeMassachusetts Institute of Technology
InventorsXuanhe Zhao, Hyunwoo Yuk, Akihisa Inoue
Life of this patent
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Abstract
Adhesion of conducting polymers on diverse insulating and conductive substrates via a hydrophilic adhesion layer, where one or more functional groups may be disposed between the substrate and the hydrophilic adhesion layer. Adhesion of the conducting polymers on the substrates is such that adhesion is maintained or substantially maintained in wet physiological environments.
Claims31
A device for use in a wet environment comprising:
- a substrate material fabricated of an insulating or conducting material, or a combination thereof, the substrate material having a top surface and a bottom surface;
- a hydrophilic adhesion layer disposed on at least a portion of one or more of the top surface and bottom surface, wherein the hydrophilic adhesion layer is configured to be applied at a nanoscale thickness between 1-1,500 nm;
- one or more conducting polymers adhered to at least a portion of one or more of the top surface and bottom surface of the substrate material via the hydrophilic adhesion layer, and
- an interpenetration layer formed through the hydrophilic adhesion layer, which acts as a bridging interface between the conducting polymer and the hydrophilic adhesion layer, providing strong interfacial adhesion,
- wherein the one or more conducting polymers are adhered with an adhesion strength that is substantially maintained when the implantable device is exposed to the wet environment.
2 more elements
A method for forming a device, which is disposed within or in contact with bodily fluids or which is used in a wet environment, comprising:
- obtaining a substrate, the substrate having a top surface and a bottom surface;
- disposing a hydrophilic adhesion layer on at least a portion of one or more of the top surface and bottom surface of the substrate, wherein the hydrophilic adhesion layer is configured to be applied at a nanoscale thickness between 1-1,500 nm;
- adhering one or more conducting polymers to at least a portion of one or more of the top surface and bottom surface of the substrate via the hydrophilic adhesion layer;
- and
- forming an interpenetration layer through the hydrophilic adhesion layer, which acts as a bridging interface between the conducting polymer and the hydrophilic adhesion layer, providing strong interfacial adhesion,
- wherein the one or more conducting polymers are adhered with an adhesion strength that is substantially maintained when the implantable device is exposed to the wet environment.
3 more elements
Dependencies are inferred from the claim text.