Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof
AssigneeMaterion Corporation
InventorsJoseph G. Kaiser, Alejandro J. Lluberes
Life of this patent
Estimating the term…
Abstract
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
Claims13
A layered structure, comprising:
- a substrate having a conductivity greater than 40% International Annealed Copper Standard (IACS) (or greater than 2.3200×107 S/m);
- and
- a contact layer disposed over at least a portion of the substrate, wherein the contact layer comprises a samarium-silver alloy consisting of:
- less than 5 wt % copper;
- more than 0% and less than 0.5 wt % nickel;
- more than 0% and less than 0.5 wt % zinc;
- from 0.05 wt % to 0.5 wt % samarium;
- balance silver and additional precious metals, and one or more oxides thereof, wherein the one or more oxides includes samarium oxide present only at the surface of the contact layer;
- and
- wherein the contact layer demonstrates a coefficient of friction of less than 1.4, as measured in accordance with American Society for Testing and Materials (ASTM) G99-17.
A charging terminal, comprising:
- a substrate having a conductivity greater than 40% IACS;
- and
- a contact layer disposed over at least a portion of the substrate, wherein the contact layer comprises a samarium-silver alloy consisting of:
- less than 5 wt % copper;
- more than 0% and less than 0.5 wt % nickel;
- more than 0% less than 0.5 wt % zinc;
- from 0.05 wt % to less than 0.5 wt % samarium;
- balance silver and additional precious metals, and one or more oxides, wherein the one or more oxides includes samarium oxide present only at the surface of the contact layer;
- and
- wherein the charging terminal demonstrates a coefficient of friction ranging from 0.1 to 1.4, as measured in accordance with ASTM G99-17.
A contact layer composition consisting of:
- less than 5 wt % copper;
- more than 0% and less than 0.5 wt % nickel;
- more than 0% and less than 0.5 wt % zinc;
- from 0.05 wt % to less than 0.5 wt % samarium;
- balance silver and additional precious metals;
- and one or more oxides thereof, wherein the one or more oxides includes samarium oxide present only at the surface of the contact layer;
- and
- wherein the contact layer composition demonstrates a coefficient of friction ranging from 0.1 to 1.4, as measured in accordance with ASTM G99-17.
A process for preparing a layered structure, the process comprising:
- providing a substrate;
- and
- forming the contact layer over the substrate,
- wherein the contact layer consists of:
- less than 5 wt % copper;
- more than 0% and less than 0.5 wt % nickel;
- more than 0% less than 0.5 wt % zinc;
- from 0.05 wt % to less than 0.5 wt % samarium;
- balance silver and additional precious metals;
- and one or more oxides thereof, wherein the one or more oxides includes samarium oxide present only at the surface of the contact layer;
- and
- wherein the contact layer composition demonstrates a coefficient of friction ranging from 0.1 to 1.4, as measured in accordance with ASTM G99-17.
Dependencies are inferred from the claim text.