Inductively-coupled plasma processing apparatus

An inductively-coupled plasma processing apparatus for performing an inductively-coupled plasma processing on a rectangular substrate, comprising:

• a processing container;
• a mounting table provided inside the processing container and configured to mount the rectangular substrate thereon;
• a rectangular metal window constituting a top wall of the processing container and provided to be electrically insulated from the processing container while facing the mounting table;
• an antenna compartment provided above the rectangular metal window;
• and
• a first high-frequency antenna provided in the antenna compartment and configured to generate an inductively-coupled plasma inside the processing container,
• wherein the rectangular metal window is divided into divided regions electrically insulated from each other by a first division extending in a radial direction toward each of corner portions of the rectangular metal window,
• wherein the first high-frequency antenna is further configured as a multi-segmented annular antenna in which a plurality of antenna segments having planar portions facing an upper surface of the rectangular metal window is arranged so that the planar portions form a rectangular frame-shaped region as a whole,
• wherein each of the plurality of antenna segments is configured by spirally winding an antenna wire in a vertical direction orthogonal to the upper surface of the rectangular metal window so that a winding axis is parallel to the upper surface of the rectangular metal window,
• wherein the plurality of antenna segments are separated from each other by partition plates electrically insulated from the rectangular metal window,
• wherein each of the partition plates has a lower end that directly faces the rectangular metal window with a gap formed between the lower end and the rectangular metal window, and
• wherein a current supplied to each of the plurality of antenna segments is controllable.