RFID assembly and assembly method thereof
AssigneeEM Microelectronic-Marin SA
InventorsPaul Muller, Christophe Entringer, Pierre Muller, Thomas Coulot, Arthur Hugh MacDougall
Life of this patent
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Abstract
An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at least one re-passivation layer. The at least one electrical contact is deposited on at least one first portion and the at least one re-passivation layer is deposited on at least one second portion, which is distinct of the at least one first portion.
Claims14
An assembly method for an RFID assembly, comprising:
- providing an integrated circuit comprising an IC contact and a dielectric layer;
- depositing an electrical contact directly on and in contact with the IC contact and/or with the dielectric layer;
- and
- re-passivating the integrated circuit by depositing a re-passivation layer directly on and in contact with the integrated circuit, by deposition of the re-passivation layer directly on and in contact with the IC contact and/or with the dielectric layer,
- wherein the electrical contact has a first electrical contact surface and a second electrical contact surface opposite to the first electrical contact surface, and the first and second contact surfaces are linked via an intermediate electrical contact surface,
- the re-passivation layer has a first re-passivation layer surface and a second re-passivation layer surface opposite to the first re-passivation layer surface, and the first and second re-passivation surfaces are linked via an intermediate re-passivation layer surface, and
- the intermediate electrical contact surface is directly on or under and in contact with the intermediate re-passivation layer surface.
An RFID assembly comprising:
- an integrated circuit including an IC contact and a dielectric layer;
- an electrical contact being disposed directly on and in contact with the IC contact and/or with the dielectric layer;
- and
- a re-passivation layer being disposed directly on and in contact with the integrated circuit,
- wherein the electrical contact has a first electrical contact surface and a second electrical contact surface opposite to the first electrical contact surface, and the first and second contact surfaces are linked via an intermediate electrical contact surface,
- the re-passivation layer has a first re-passivation layer surface and a second re-passivation layer surface opposite to the first re-passivation layer surface, and the first and second re-passivation surfaces are linked via an intermediate re-passivation layer surface, and
- the intermediate electrical contact surface is directly on or under and in contact with the intermediate re-passivation layer surface.
An RFID assembly, comprising:
- an integrated circuit including an IC contact and a dielectric layer;
- an electrical contact being disposed directly on and in contact with the IC contact and/or with the dielectric layer;
- and
- a re-passivation layer being disposed directly on and in contact with the integrated circuit,
- wherein the electrical contact has a first electrical contact surface and a second electrical contact surface opposite to the first electrical contact surface,
- the re-passivation layer has a first re-passivation layer surface and a second re-passivation layer surface opposite to the first re-passivation layer surface,
- a primary dimension is a distance between the first electrical contact surface and the second electrical contact surface, and a secondary dimension is a distance between the first re-passivation layer surface and the second re-passivation layer surface, and
- a dimension ratio of the primary dimension to the secondary dimension is between 0.5 and 2.
Dependencies are inferred from the claim text.