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US 12,152,940 B2Granted
Sensor device
AssigneeSony Semiconductor Solutions Corporation
InventorsTakahiro Wakabayashi, Kenichi Taguchi
Life of this patent
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Abstract
A sensor device according to the present disclosure includes a Peltier element, a sensor element thermally connected to a cooling surface of the Peltier element, and a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass.
Claims11
A sensor device comprising:
- a Peltier element;
- a sensor element thermally connected to a cooling surface of the Peltier element;
- a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass;
- and
- a support member, wherein the support member has an opening that allows passage of incident light and a frame that supports the window member, and wherein the window member is disposed above and overlaps a portion of the frame.
2 more elements
Dependencies are inferred from the claim text.