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US 12,151,427 B2Granted
Housing structure manufacturing method and electronic device
AssigneeAdata Technology Co., Ltd.
InventorsLuca Di Fiore, Shih-Huang Tsai, Chih-Chun Huang, Hsin-Cheng Hsu
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Abstract
A housing structure manufacturing method and an electronic device are provided. The housing structure manufacturing method includes providing a plurality of memory polymeric materials, heating the plurality of memory polymeric materials, and forming the housing structure having a first morphology by printing the plurality of memory polymeric materials that are heated.
Claims10
A manufacturing method, comprising:
- providing a mixture of memory polymeric materials;
- performing a heating process on the mixture of memory polymeric materials and feeding the mixture of memory polymeric materials to a 3D printing device;
- and
- forming a housing structure having a first morphology from the mixture of memory polymeric materials by performing 3D printing,
- wherein the mixture of memory polymeric materials includes polyamide 12 and hydrogel.
2 more elements
A manufacturing method, comprising:
- providing a mixture of memory polymeric materials;
- performing a heating process on the mixture of memory polymeric materials and feeding the mixture of memory polymeric materials to a 3D printing device;
- and
- forming a housing structure having a first morphology from the mixture of memory polymeric materials by performing 3D printing,
- wherein the mixture of memory polymeric materials includes polyamide 12 and hydrogel,
- wherein the providing a mixture of memory polymeric materials comprises mixing and heating polyamide 12 and hydrogel with a heating temperature between 150° C. and 180° C. for a time period of 12 hours.
3 more elements
Dependencies are inferred from the claim text.