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US 12,150,254 B2Granted
Method of forming a laminate structure having a plated through-hole using a removable cover layer
AssigneeSanmina Corporation
InventorsShinichi Iketani, Dale Kersten
Life of this patent
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Abstract
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
Claims8
A method for making a laminated structure, comprising:
- forming a first core or sub-composite structure, the first core or sub-composite structure comprising:
- a first conductive film comprising a removable or peelable first cover layer formed on a first conductive layer;
- a dielectric layer coupled to the first conductive layer of the first conductive film;
- forming a hole in the first core or sub-composite structure, the hole extending through the first conductive film and the dielectric layer;
- depositing a plating resist in the hole in the first core or sub-component structure, and over at least a portion of the first cover layer;
- and
- removing the first cover layer to clean off excess or residual plating resist on the first core or sub-component structure.
4 more elements
Dependencies are inferred from the claim text.