System for providing dynamic feedback for selective adhesion PCB production

A system for providing dynamic feedback for selective adhesion printed circuit board (PCB) production, the system comprising:

• a conveyor mechanism configured to convey a series of selective adhesion blanks, each selective adhesion blank being prepopulated with parts and utilized to produce a PCB, each selective adhesion blank including:
• a flexible film forming a top layer of the selective adhesion blank,
• a substrate forming a bottom layer of the selective adhesion blank,
• a conductive layer formed from electrically conductive material and adhered to the substrate, and
• a curable adhesive positioned between the flexible film and the conductive layer, the curable adhesive configured to selectively bond with the conductive layer when the curable adhesive is cured;
• an optical inspection unit configured to generate current image data of each selective adhesion blank;
• a curing system configured to cure the curable adhesive for each selective adhesion blank;
• and
• a computer including a processing element in electronic communication with a memory element, the processing element configured or programmed to:
• receive a PCB design including placement of the parts and a pattern of traces and pads,
• receive the current image data,
• compare the current image data with standard image data corresponding to the PCB design,
• determine a modification to the PCB design if a difference between the current image data and the standard image data is detected, and
• direct the curing system to cure the curable adhesive of each selective adhesion blank for which the difference is detected according to the modification of the PCB design.