Substrate treating apparatus and substrate treating system comprising the same

A method for configuring a substrate treating apparatus, the apparatus comprising:

• a first chamber heat-treating a substrate by using an anneal process;
• and
• a second chamber treating the substrate in another way different from heat-treatment, the method comprising:
• varying a number of the first chambers depending on a number of the second chambers that need heat treatment for the substrate,
• determining the number of the second chambers that need heat treatment for the substrate depending on whether process by-products are generated when the substrate is treated in the second chambers, such that heat treatment is needed for the second chambers in which process by-products are generated, and heat treatment is not needed for the second chambers in which process by-products are not generated, and
• determining whether the process by-products are generated depending on at least one of a process temperature or a type of a material to be treated.

A method for configuring a substrate treating system, the system comprising:

• a substrate treating apparatus including a first chamber heat-treating a substrate, and a second chamber treating the substrate in another way different from heat-treatment;
• and
• a controller controlling a process connection method between the first chamber and the second chamber, the method comprising:
• varying a number of the first chambers depending on a number of the second chambers that need heat treatment for the substrate, and
• determining the number of the second chambers that need heat treatment for the substrate depending on whether process by-products are generated when the substrate is treated in the second chambers, such that heat treatment is needed for the second chambers in which process by-products are generated, and heat treatment is not needed for the second chambers in which process by-products are not generated.