Film-closure apparatus for plastic film material, printed circuit board, and method of enhancing the operation of a film-closure apparatus
AssigneeGreen Light Packaging Limited
InventorMark Bonning
Life of this patent
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Abstract
A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.
Claims16
A film-closure apparatus for closing plastic film material using heat, the film-closure apparatus comprising:
- a guide path along which at least part of a plastics film material can pass;
- a driving mechanism for moving the film material along the guide path;
- and
- a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface;
- the electrically conductive heating element being positionable on the guide path to apply heat to the film material thereon;
- and
- the perimeter edge surface comprising four linear edge surface sections, the electrically conductive heating element being provided along one linear edge surface section.
Dependencies are inferred from the claim text.