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US 12,144,110 B2Granted
Reduced vertical profile ejector for liquid cooled modules
AssigneeIntel Corporation
InventorsGuixiang Tan, Xiang Li, Casey Winkel, George Vergis
Life of this patent
Estimating the term…
Abstract
An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.
Claims9
An apparatus, comprising:
- a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors, the ejectors having a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.
A dual in-line memory module (DIMM), comprising:
- unbent liquid cooling conduits that run from one end of the DIMM to the other end of the DIMM.
An electronic system, comprising:
- a liquid cooling system;
- a printed circuit board (PCB), a dual in-line memory module (DIMM) connector on the PCB;
- and
- a DIMM that is plugged into the DIMM connector, the DIMM having liquid cooling conduits that run straight across the DIMM, the liquid cooling conduits connected to the liquid cooling system, wherein the DIMM connector comprises ejectors that reside beneath the liquid cooling conduits.
1 more element
Dependencies are inferred from the claim text.