Wiring board and method for manufacturing wiring board

A wiring board comprising:

• a substrate that is stretchable, the substrate including a first surface and a second surface located opposite to the first surface;
• wiring located at the first surface side of the substrate;
• a reinforcing part that overlaps the wiring when viewed in a direction normal to the first surface of the substrate, and
• a support substrate including polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate, wherein
• the substrate includes a control region that overlaps the reinforcing part and the support substrate, and a non-control region that overlaps the support substrate but that does not overlap the reinforcing part, the non-control region being positioned to sandwich the control region in a direction orthogonal to a direction in which the wiring extends,
• the control region includes a plurality of ridges located at the first surface side of the substrate, the plurality of ridges extending across the control region in a direction transverse to the direction in which the wiring extends, the plurality of ridges being arranged in the direction in which the wiring extends,
• the non-control region includes a plurality of intersecting ridge groups located at the first surface side of the substrate, the plurality of intersecting ridge groups each including a plurality of ridges that extend in different directions and cross each other, and
• the ridges in the control region have an amplitude greater than an amplitude of the ridges in the non-control region.

A wiring board comprising:

• a substrate that is stretchable, the substrate including a first surface and a second surface located opposite to the first surface;
• wiring located at the first surface side of the substrate;
• a reinforcing part that overlaps the wiring when viewed in a direction normal to the first surface of the substrate, and
• a support substrate including polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate, wherein
• the substrate includes a control region that overlaps the reinforcing part and the support substrate, and a non-control region that overlaps the support substrate but that does not overlap the reinforcing part, the non-control region being positioned to sandwich the control region in a direction orthogonal to a direction in which the wiring extends,
• the control region includes a plurality of ridges located at the first surface side of the substrate, the plurality of ridges extending across the control region in a direction transverse to the direction in which the wiring extends, the plurality of ridges being arranged in the direction in which the wiring extends,
• the non-control region includes a plurality of intersecting ridge groups located at the first surface side of the substrate, the plurality of intersecting ridge groups each including a plurality of ridges that extend in different directions and cross each other,
• the control region includes a plurality of ridges located at the second surface side of the substrate, and
• the ridge located at the second surface side of the substrate has an amplitude smaller than an amplitude of the ridge located at the first surface side of the substrate.

A method for manufacturing a wiring board, comprising:

• an elongation step of elongating a substrate by applying tensile stress to the substrate in a first direction and in a second direction transverse to the first direction, the substrate being stretchable;
• a wiring step of disposing wiring at a location adjacent to a first surface of the substrate that is in an elongated state;
• and a contraction step of removing the tensile stress from the substrate, wherein the wiring board includes a reinforcing part, the reinforcing part overlapping the wiring when viewed in a direction normal to the first surface of the substrate, and a support substrate including polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate, wherein the substrate includes a control region that overlaps the reinforcing part, support substrate and the wiring, and a non-control region that overlaps the support substrate but that does not overlap the reinforcing part, the non-control region being positioned to sandwich the control region in a direction orthogonal to a direction in which the wiring extends, the control region includes a plurality of ridges located at the first surface side of the substrate, the plurality of ridges extending across the control region in a direction transverse to the direction in which the wiring extends, the plurality of ridges being arranged in the direction in which the wiring extends, the non-control region includes a plurality of intersecting ridge groups located at the first surface side of the substrate, the plurality of intersecting ridge groups each including a plurality of ridges that extend in different directions and cross each other, and the ridges in the control region have a width greater than a width of the ridges in the non-control region.