Methods of plasma dicing bulk acoustic wave components
AssigneeSkyworks Solutions, Inc.
InventorsAtsushi Takano, Takeshi Furusawa, Mitsuhiro Furukawa
Life of this patent
Estimating the term…
Abstract
Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components
Claims20
A method of manufacturing a bulk acoustic wave component, the method comprising:
- providing a substrate with a bulk acoustic wave resonator thereon, the bulk acoustic wave resonator being enclosed within a cap;
- forming a conductor over the substrate, the conductor extending laterally from a via extending through the substrate, the conductor being electrically connected with a conductive layer in the via, and the conductor being on an opposite side of the substrate than the bulk acoustic wave resonator;
- forming a buffer layer over the substrate so as to form exposed streets between the bulk acoustic wave component and adjacent bulk acoustic wave components;
- and
- plasma dicing through the substrate and a cap substrate of the cap along the exposed streets to thereby singulate the bulk acoustic wave component.
A method of manufacturing a bulk acoustic wave component, the method comprising:
- forming a conductor over a substrate, the conductor extending laterally from a via extending through the substrate, the conductor being electrically connected with a conductive layer in the via, and the conductor being on an opposite side of the substrate than a bulk acoustic wave resonator;
- forming solder on the conductor such that the solder is located laterally from the via;
- forming a buffer layer over the substrate so as to form exposed streets between the bulk acoustic wave component and adjacent bulk acoustic wave components;
- and
- plasma dicing along the exposed streets to thereby singulate the bulk acoustic wave component.
A method of manufacturing a bulk acoustic wave component, the method comprising:
- forming a conductor over a substrate, the conductor extending laterally from a via that extends through the substrate, the conductor being electrically connected to a conductive layer in the via, the conductor being on an opposite side of the substrate than a bulk acoustic wave resonator, and the bulk acoustic wave resonator being enclosed within a cap;
- and
- plasma dicing through the substrate and a cap substrate of the cap to thereby singulate the bulk acoustic wave component.
Dependencies are inferred from the claim text.