Phosphor element with heat dissipating substrate that has thermally conductive metal plating film
AssigneeNGK Insulators, Ltd.
InventorsJungo Kondo, Keiichiro Asai, Naotake Okada
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Abstract
A phosphor element includes a phosphor part including an incident face of the excitation light, opposing face opposing the incident face, and side face, the phosphor part converting at least a part of the excitation light incident onto the incident face to fluorescence and emitting the fluorescence from the opposing face or incident face, and a heat dissipating substrate provided on the side face of the phosphor part. The heat dissipating substrate is composed of a metal plating film composed of a metal having a thermal conductivity of 200 W/mK or higher.
Claims8
A phosphor element comprising:
- a phosphor part including an incident face of an excitation light, an opposing face opposing said incident face, and a side face, said phosphor part converting at least a part of said excitation light incident onto said incident face to a fluorescence and emitting said fluorescence from said opposing face or said incident face,
- a heat dissipating substrate directly or indirectly provided over said side face of said phosphor part, said heat dissipating substrate comprises a metal plating film comprising a metal having a thermal conductivity of 200 W/mK or higher,
- wherein said heat dissipating substrate comprises a main face on a side of said incident face and a main face on a side of said opposing face, and
- wherein an angle of said incident face and of a direction of growth of said metal plating film on a main face on said side of said opposing face or a main face on said side of said incident face of said heat dissipating substrate is 60° to 120°.
An illumination device comprising:
- a light source oscillating a laser light;
- and
- a phosphor element comprising:
- a phosphor part including an incident face of an excitation light, an opposing face opposing said incident face, and a side face, said phosphor part converting at least a part of said excitation light incident onto said incident face to a fluorescence and emitting said fluorescence from said opposing face or said incident face,
- a heat dissipating substrate directly or indirectly provided over said side face of said phosphor part, said heat dissipating substrate comprises a metal plating film comprising a metal having a thermal conductivity of 200 W/mK or higher,
- wherein said heat dissipating substrate comprises a main face on a side of said incident face and a main face on a side of said opposing face, and
- wherein an angle of said incident face and of a direction of growth of said metal plating film on a main face on said side of said opposing face or a main face on said side of said incident face of said heat dissipating substrate is 60° to 120°.
Dependencies are inferred from the claim text.